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Rapidus CORE is a new framework intended to help customers develop advanced chips for Rapidus’s planned 2nm foundry. Announced on October 5, 2026, its first initiative brings together 17 design firms to provide expertise and connect prospective customers with design resources. The announcement describes winning customers as an aim—not a result: it names no new customers or production contracts.
What is Rapidus CORE?
CORE stands for Collaborative Open Rapid Ecosystem. Rapidus describes it as a global framework for supporting the development and mass production of advanced semiconductors. Its first initiative is a network of Design Solution Associates that can help customers begin chip-design work and navigate the path from design to manufacturing. Rapidus says the support is intended to serve customers in Japan and overseas. Rapidus’s October 5, 2026 announcement
The associates are meant to act as a bridge between customers and Rapidus, contributing their own design resources and specialized expertise. That could make it easier for prospective customers to explore a design for Rapidus’s process; it does not establish that a customer has selected the foundry or placed an order.
Which 17 firms are in the first group?
Rapidus named these Design Solution Associates, in the order listed in its announcement:
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- Cadence Design Systems, Inc.
- Dai Nippon Printing Co., Ltd.
- GreatAsic Technology Sdn. Bhd.
- HCL Technologies Limited
- Infinecs Systems Sdn. Bhd.
- Infosys Limited
- MavissDesign Co., Ltd.
- MosChip Technologies Limited
- NSW Inc.
- Oppstar Technology Sdn Bhd
- Quest Global Services Pte. Ltd.
- SkyeChip Berhad
- Synopsys, Inc.
- TOPPAN Inc.
- Toshiba Information Systems (Japan) Corporation
- Wipro Limited
The announcement identifies the firms as design associates, but does not specify individual assignments, customer projects, or how their services will be contracted.
How might the group help Rapidus attract customers?
Developing a chip for a new manufacturing process requires design work as well as a route to production. By connecting customers to firms with relevant design resources and expertise, CORE is intended to help prospective customers start earlier and receive support across more of that process. That is the business rationale for the initiative; Rapidus has not reported that the group has secured customer commitments.
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Rapidus says it plans to expand CORE beyond design to include electronic design automation (EDA), intellectual property (IP), and other categories. It has not announced a timetable or named later participants. The October announcement also provides no comparative metrics or pricing for evaluating its design support, process maturity, turnaround time, or production commitments against other foundries.
Where does Rapidus stand on production?
Rapidus says its pilot line at IIM, its integrated innovation and manufacturing hub in Chitose, Hokkaido, has operated since April 2025. The company schedules mass production for 2027. That date is a stated target, not evidence that volume production has begun or that the transition is assured. Rapidus technology overview
Rank #3
- Semiconductor thermoelectric chip TGM-199-1.4-0.8
What does the funding figure show—and what does it not show?
On February 27, 2026, Rapidus announced a funding round totaling 267.6 billion yen: 100 billion yen from Japan’s Information-Technology Promotion Agency and 167.6 billion yen from 32 private-sector companies. These figures describe the announced sources and scale of financing. They do not establish that manufacturing milestones will be met or that customers have committed to production. Rapidus funding announcement, February 27, 2026
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- AUTHENTIC BARE DIE APPEARANCE-- Displays the exposed structure of a semiconductor die before final packaging, providing a direct view of chip layout and microelectronic design features.
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- IDEAL FOR TECHNICAL EDUCATION --Suitable for engineering courses, electronics training, semiconductor learning and STEM activities where physical examples support technical instruction.
- DISPLAY AND PRESENTATION USE --Can be incorporated into technology exhibitions, laboratory displays, classroom demonstrations and microelectronics presentations.
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Rank #4
- AUTHENTIC BARE DIE APPEARANCE-- Displays the exposed structure of a semiconductor die before final packaging, providing a direct view of chip layout and microelectronic design features.
- INTEGRATED CIRCUIT REFERENCE SAMPLE --Features visible IC circuitry and semiconductor architecture, making it a useful reference piece for understanding chip manufacturing concepts.
- IDEAL FOR TECHNICAL EDUCATION --Suitable for engineering courses, electronics training, semiconductor learning and STEM activities where physical examples support technical instruction.
- DISPLAY AND PRESENTATION USE --Can be incorporated into technology exhibitions, laboratory displays, classroom demonstrations and microelectronics presentations.
- COLLECTIBLE TECHNOLOGY ARTIFACT-- Combines semiconductor engineering with visual appeal, making it suitable for collectors, electronics enthusiasts and technology-themed displays.
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