VIS and NXP’s Singapore joint venture, VisionPower Semiconductor Manufacturing Company (VSMC), opened its first 300mm wafer fab in Tampines on September 28, 2026. The project is an approximately $7.8 billion build-out for specialty chips, with VIS holding 60% of the venture and NXP 40%. The latest announced target is capacity of 44,000 12-inch wafers a month by 2029—not a claim that this capacity is already online.
What the companies are building
VSMC is a semiconductor foundry: it manufactures wafers for chip products rather than being described as a facility dedicated only to one partner’s chips. The site is in Tampines, Singapore, and is designed for 300mm wafers, also called 12-inch wafers. Larger wafers can accommodate more chips than smaller ones, although the number and type of usable chips depend on the design and manufacturing process.
As an Amazon Associate I earn from qualifying purchases.
The stated technology range for the original plan is 130nm to 40nm, covering mixed-signal, power-management, and analog processes. These technologies serve products that combine or manage different kinds of signals and power, rather than relying only on the smallest available transistor dimensions. The initial plan called for process technologies licensed and transferred from TSMC.
At the September 2026 opening, VSMC described its specialty foundry services as covering mixed-signal, power, analog, and interposer technologies. It listed automotive, industrial, consumer, mobile, and high-performance computing among the application markets. The opening announcement does not specify which customers have orders or which products are already being manufactured.
#1 Best Overall
- 5 x 5 inches, 0.67 ounces, 0.03 inches thick. Some wafers are marked with alignment marks.
- The pattern is produced by light diffraction, and its reflective appearance changes with the viewing angle.
- Silicon wafers are fragile—please handle with care.
- Circuit details can be examined under a microscope.
Ownership, control and capacity rights
VIS, a Taiwan-based semiconductor company, owns 60% of VSMC; Dutch semiconductor company NXP owns 40%. VIS operates the fab. NXP has said it is entitled to 40% of the fab’s capacity, giving the partnership an assured supply allocation while VSMC is also intended to serve as an independent commercial foundry.
For NXP, the venture fits a hybrid manufacturing strategy that combines in-house and external manufacturing. The companies have framed the Singapore location as a way to strengthen geographic resilience in the supply chain. That rationale does not, by itself, establish how much production will be allocated to any particular customer or what the venture’s financial returns will be.
Rank #2
- 🔴 161 pcs 20 models, Each with individual compartment. Pin assignment table included.
- 🔴 IC Plier included for easy picking and removing IC
- 🔴 Op Amp: LM358 LM324 JRC4558 NE5532 LM386 TDA2030 TDA2822 UA741 Comparators: LM393 LM339
- 🔴 PhotoCoupler: PC817 Multivibrator: CD4047 Analog Multiplexer: CD4053 Echo Audio Processor: PT2399
- 🔴 PWM controller: UC3842 UC3843 Darlington Array ULN2003 ULN2803, Voltage Converter 7660 Timer: NE555
How much the project costs and how it is funded
The announced initial build-out is approximately $7.8 billion. The companies described the funding components as follows:
Windows Errors? Fix Them Before They Spread
Repair common Windows errors and clear accumulated junk for a smoother, more stable PC - no reinstall needed.Free scan · no reinstallCrashes, No Sound, or Screen Glitches?
Random freezes, missing sound and display glitches usually trace back to one bad driver. Find and replace yours safely.Free scan · under a minute| Funding component | Announced amount | What it represents |
|---|---|---|
| VIS contribution | $2.4 billion | VIS’s planned investment in the venture. |
| NXP contribution | $1.6 billion | NXP’s planned investment in the venture. |
| Combined partner contribution | $1.9 billion | Additional investment by VIS and NXP for long-term capacity infrastructure. |
| Third-party funding | Balance of the announced build-out; exact amount not stated | Remaining funding, including loans, is to come from third parties. |
These figures describe the announced project financing, not a reported final audited cost, the fab’s operating expenses, or a forecast of profit. Because the overall amount is approximate and the partners identify a balance funded by third parties, the listed contributions should not be treated as a complete breakdown of exact cash sources.
Rank #3
- Precision 3D-Printed Resin Core – Multi‑layer colored detailing accurately reproduces chip architecture
- High-Clarity Acrylic Shell – Fully transparent for unobstructed internal structure viewing
- Compact Study Size – 80×80×30 mm, ideal for desktop display and hands‑on handling
- Educational Focus – Designed for classroom instruction, university labs, science fairs, and tech exhibitions
- Steady & Lightweight – Sturdy yet portable for repeated use in teaching environments
Project timeline and production status
| Date | Milestone | What it establishes |
|---|---|---|
| June 5, 2024 | VIS and NXP announced the joint venture plan. | The initial construction phase was planned to begin in the second half of 2024, subject to regulatory approvals, with customer production targeted for 2027. |
| September 4, 2024 | The companies announced VSMC’s formal establishment. | They said the necessary approvals had been obtained and capital injected. |
| December 4, 2024 | VSMC held its groundbreaking in Tampines. | The company said construction remained on track for initial production in 2027. |
| September 28, 2026 | VSMC held the grand opening of its first 12-inch fab. | The site reached an opening milestone, but the announcement does not say that full-scale customer production has started. |
So, the fab is open as a facility, but the available opening announcement does not give a confirmed date for the start of customer production. The 2027 date was a target stated in 2024, not confirmation that production began then. An opening ceremony and a production ramp are distinct milestones.
Capacity: the latest target and the earlier plan
Capacity figures changed between announcements. VSMC’s June 2024 plan projected 55,000 300mm wafers per month in 2029, and its December 2024 groundbreaking release repeated that figure. The September 28, 2026 opening release instead gave an expectation of 44,000 12-inch wafers per month by 2029. The 44,000 figure is the latest of these official estimates; neither figure means that the monthly volume is already being produced.
Rank #4
- Minidodoca high quality 24 Values 173 Pcs IC Assortment Kit
- IC chip Assortment contains: Op Amp: LM358 LM324 JRC4558 NE5532 LM386 TDA2030 TDA2822 UA741 ;Comparators: LM393 LM339;PhotoCoupler: PC817 ;Multivibrator: CD4047;Analog Multiplexer: CD4053;Echo Audio Processor: PT2399; PWM controller: UC3842 UC3843; Darlington Array ULN2003 ULN2803;Voltage Converter 7660; Timer: NE555
- Including 3 pcs DIP8 socket, 3 pcs DIP14 socket, 3 pcs DIP16 socket, 3 pcs DIP18 socket
- Including 1pc IC Plier included for easy picking and removing IC chips
- Minidodoca ic kit Complete specifications, clear markings, easily identifiable models, sufficient quantity, durable materials, nickel plated surface, not easy to rust, ensuring a long service life.
The releases do not explain the reason for the difference, so it should be treated as a change in the stated target rather than an explained reduction. Both figures refer to a monthly wafer capacity target for 2029, not the number of finished chips or shipments.
Free tools Windows power users keep installed
One-click scans. No signup required.
Jobs, automation and environmental measures
The original 2024 announcement projected approximately 1,500 Singapore jobs. VSMC has described the facility as using a fully automated production model, including an Automated Material Handling System and AI applications for quality management. Those descriptions outline the planned operating approach; they do not establish current staffing or measured manufacturing performance.
Best Value
- AUTHENTIC SILICON SAMPLE: Real silicon wafer die sample featuring genuine wafer surface patterns, designed for semiconductor learning, research demonstration, and technology display purposes.
- NON-FUNCTIONAL SPECIMEN: This silicon sample is a display and educational specimen only. It is not an electronic component and does not perform computing or electrical functions.
- SEMICONDUCTOR EDUCATION USE: Suitable for classrooms, laboratories, engineering courses, STEM activities, and demonstrations of wafer structures and semiconductor manufacturing concepts.
- TECHNOLOGY DISPLAY ITEM: Ideal for exhibitions, science displays, collections, and demonstrations related to microelectronics and semiconductor technology.
- INDIVIDUAL PACKAGING: Each sample is separately packaged to help maintain surface cleanliness and reduce scratches during storage and handling.
The construction and operating measures VSMC has described include Singapore Green Mark standards, energy-efficient cooling and lighting, process-water recycling, and eco-friendly materials. The September 2026 opening release also said the company had signed memoranda of understanding with Singapore universities and was developing internship and professional-training programs to support semiconductor talent development.
Quick Recap
Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.
