HP’s Corvallis, Oregon, facility is set to receive up to $53 million in direct federal funding through the CHIPS Act. The U.S. Department of Commerce announced the award on January 13, 2025, naming HPI Federal LLC as the recipient; the money is tied to project milestones, not confirmed as already paid.
What HP’s CHIPS Act award will fund
The funding supports expansion and modernization of HP Inc.’s existing facility in Corvallis, Oregon. Commerce describes the site as part of a regional “lab-to-fab” ecosystem, linking research and development with commercial manufacturing.
The project involves silicon devices used in life-sciences laboratory equipment, including equipment for drug discovery, single-cell research and cell-line development. The work draws on HP’s microfluidics and microelectromechanical systems (MEMS) expertise. Commerce’s award announcement provides these project details.
How much money is HP getting—and has it been paid?
The award is up to $53 million in direct funding, an award ceiling rather than a statement that HP has received the full amount. Commerce said payments would be made as the recipient completes project milestones. The announcement followed a preliminary memorandum of terms announced August 27, 2024, and the department’s due diligence.
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The named recipient is HPI Federal LLC, while the supported facility belongs to HP Inc. The distinction matters: the award announcement identifies the LLC as the grant recipient and HP Inc.’s Corvallis site as the project location.
The U.S. Government Accountability Office’s December 2025 award accounting lists one HP project with $53 million in direct funding, rounded to the nearest million. That accounting covers Commerce awards made from September 2024 through July 2025 and excludes amendments made after July 2025. It does not establish how much HP had actually received by October 4, 2026, or whether its terms changed after the reporting cutoff. GAO-26-107882
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What jobs are projected?
Commerce estimated the project would create and sustain nearly 150 construction jobs and more than 100 manufacturing jobs. These are projections for the project, not verified counts of jobs already created.
How HP’s award fits into the broader CHIPS program
GAO reported that Commerce had funded 49 semiconductor facilities and equipment projects as of July 15, 2026. Across the program, $13.1 billion had been disbursed to awardees as of April 2026—about 42% of the $31.5 billion in direct funding. Those totals describe the program as a whole and do not show HP’s payment status. GAO-26-109121
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The Commerce Department’s Inspector General describes the broader CHIPS Act funding structure as $39 billion for direct semiconductor facility-related assistance, $11 billion for regional technology hubs, and $10 billion for NIST research and support for small manufacturers. These are program-level categories, not additional funds in HP’s individual award. Commerce Office of Inspector General: Semiconductor Manufacturing
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.What the announcement said
In the January 2025 announcement, then-Commerce Secretary Gina Raimondo said, “Companies like HP are developing the technologies that will spur unprecedented breakthroughs for generations to come.” HP President and CEO Enrique Lores said, “HP is pleased its CHIPS grant has been finalized, which will bolster semiconductor production and innovation in the United States.” Both comments were made at the time of the 2025 announcement.
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