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Clear out junk files and repair common Windows errorsFree Scan →Fix the driver behind crashes, sound loss and screen glitchesFind Drivers →Repair Windows errors before they cause bigger problemsFix Now →Adeia-affiliated companies sued AMD in federal court, alleging that the company’s chip technologies infringed 10 patents, including patents related to hybrid bonding used in 3D V-Cache. The case is no longer pending: Adeia filed a settlement notice on March 9, 2026, and the court dismissed it on March 10. The docket listing does not disclose the settlement terms, and the materials reviewed do not establish that a court found infringement.
What was Adeia’s lawsuit against AMD about?
Adeia Semiconductor Bonding Technologies Inc., Adeia Semiconductor Inc., and Adeia Semiconductor Solutions LLC filed suit against Advanced Micro Devices, Inc. in the U.S. District Court for the Western District of Texas on November 3, 2025. Adeia described two lawsuits alleging infringement of 10 patents: seven involving hybrid bonding and three involving advanced process-node technology. That breakdown is Adeia’s account of its claims, not a court finding. Adeia’s announcement also said the company had more than 13,000 worldwide patent assets, a portfolio figure reported by Adeia itself.
Adeia CEO Paul E. Davis said the company took legal action “to protect our intellectual property rights and the investments we have made in our foundational semiconductor technologies.” He also said Adeia believed litigation was necessary after efforts to reach a resolution. These statements describe Adeia’s position when it filed; they do not independently establish infringement.
Why is AMD being sued over 3D V-Cache?
AMD’s 3D V-Cache stacks cache dies vertically on a processor. In an AMD technical brief, the company describes its approach as a “bumpless” chip-on-wafer process using copper-to-copper hybrid bonding. In broad terms, hybrid bonding joins dies through dense direct connections rather than conventional solder bumps. That technical context helps explain why bonding technology is relevant to the dispute, but it does not show that Adeia’s patents cover AMD’s implementation or that AMD infringed them.
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Adeia’s announcement divided its alleged patents into two groups. Hybrid-bonding patents concern ways of joining stacked semiconductor dies; the other three patents were described as addressing advanced process-node technology. The available materials do not provide enough detail to explain the scope or legal strength of each individual patent claim, so the two groups should not be treated as proof of a particular technical or legal conclusion.
Which AMD products did the complaint name?
The complaint reproduction names multiple Ryzen X3D processors, as well as EPYC X processors and Instinct MI accelerators. The Ryzen list includes:
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This is the plaintiff’s accused-product list in the case docket and complaint record. Naming a product in a complaint is an allegation, not a judicial determination about that product.
What does AMD’s technology brief say about cache?
AMD’s brief describes vertical cache stacking in its 3D V-Cache technology and reports up to 96 MB of L3 cache per die for some EPYC 9004 configurations. That figure applies to the configurations described in the brief; it is not a specification for every Ryzen X3D processor. AMD’s account of its process and product capabilities is useful technical context, not evidence resolving Adeia’s patent claims.
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Did Adeia’s lawsuit against AMD get settled?
Yes. The docket records an Adeia settlement notice filed on March 9, 2026, followed by an order dismissing the case on March 10, 2026. The available docket listing does not state the settlement’s financial or licensing terms. The reviewed materials therefore do not establish whether AMD made a payment, took a license, or agreed to any particular arrangement.
The dismissal means this case is not currently pending. It does not, by itself, establish that a court decided the infringement allegations in Adeia’s favor or AMD’s favor. No damages estimate, royalty rate, or quantified effect on processor prices or performance is established in the available materials.
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