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1Repair Windows errors before they cause bigger problems2Scan for outdated or missing drivers - takes under a minute3Clear out junk files and repair common Windows errorsThe world’s leading semiconductor fabrication plants are concentrated in Taiwan and South Korea, with important manufacturing networks in the United States, China, Japan, Singapore, Ireland, Israel and Germany. There is no single objective ranking of “leading” fabs: advanced process capability, wafer capacity and the number of operating sites measure different things. The locations below are a representative geographic overview, not a complete or capacity-ranked inventory.
Where are the main semiconductor-fab clusters?
Company disclosures point to several important regional clusters rather than one country containing all leading production. Taiwan and South Korea stand out in the networks covered here; the United States also has multiple manufacturing locations. Other significant sites and projects are spread across Europe and Asia.
The table separates locations identified by manufacturers from project details that have a stated status. A location listed as a production site is not automatically evidence that every process or product is made there. Where a source names a place but does not establish a specific operating status or process, the table does not infer one.
| Country or region | Manufacturer(s) | Locations identified | Status or detail established in the cited company material |
|---|---|---|---|
| Taiwan | TSMC | Hsinchu, Tainan and Kaohsiung; the company also describes operations in central Taiwan | TSMC identifies multiple 12-inch and smaller fabs on the island. Its 2025 annual report says annual capacity across facilities it and its subsidiaries manage exceeded 17 million 12-inch-equivalent wafers in 2025; that is a company-wide figure, not output or capacity for an individual site. |
| South Korea | Samsung Foundry | Giheung, Hwaseong and Pyeongtaek | Samsung says Hwaseong produces processes from 10 nm to 3 nm and that Pyeongtaek mass-produces advanced nodes. These are company descriptions, not a standardized comparison with other manufacturers. |
| United States | Intel | Chandler, Arizona; Rio Rancho, New Mexico; Hillsboro, Oregon | Intel lists these among its production fab locations. The company separately stated that it had 15 production wafer fabs at 10 locations worldwide; its US locations listed here are only a subset. |
| United States | Samsung Foundry | Austin and Taylor, Texas | Both are identified in Samsung Foundry’s manufacturing network; the cited material does not establish a process or production status for each location here. |
| United States | TSMC | Phoenix, Arizona | TSMC reported that its first Arizona facility entered volume production of 4 nm in the fourth quarter of 2024. In its 2025 report, the second facility was built and installing facility systems, while a third was under construction. |
| Ireland and Israel | Intel | Leixlip, Ireland; Jerusalem and Kiryat Gat, Israel | Intel identifies these among its production-fab locations. |
| Germany | GlobalFoundries and TSMC | Dresden | GlobalFoundries describes its Dresden operation as a high-volume manufacturing site serving long-lifecycle applications. Separately, TSMC’s 2025 report described its specialty-technology Dresden fab as under construction. |
| China | TSMC | Nanjing | The company’s fab directory lists the location; the cited material does not establish a specific process or operating status for this overview. |
| Japan | JASM, TSMC’s Japan-based joint venture | Kumamoto | TSMC’s 2025 report says the first fab began volume production at the end of 2024. Construction of a second began in 2025; its planned use of 3 nm technology is a plan, not a claim about current production. |
| Singapore | GlobalFoundries and UMC | GlobalFoundries’ Singapore manufacturing hub; UMC Fab 12i and an announced new facility adjacent to its existing Pasir Ris fab | GlobalFoundries describes Singapore as a high-mix, high-volume specialty-technology hub. UMC identifies Fab 12i and, in an April 2025 release, described its new facility as designed for 22 nm and 28 nm manufacturing. The release establishes the project and process plan, not its later operating status. |
Where are TSMC, Intel and Samsung’s fabs?
TSMC: Taiwan, with facilities and projects abroad
TSMC’s Taiwanese manufacturing footprint includes Hsinchu, Tainan and Kaohsiung, spanning northern, southern and central parts of the island. Its fab directory also lists Nanjing in China. Beyond those locations, its 2025 reporting distinguishes an operating Arizona facility from two later-stage Arizona facilities, and records volume production at the first Kumamoto fab alongside construction of a second. The company also reported its Dresden specialty fab as under construction.
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These distinctions matter when reading a map: a company’s fab directory can show where it has a presence, while a dated annual report may provide more precise information about whether a particular project is producing, installing systems or still being built.
Intel: US sites and manufacturing in Europe and Israel
Intel’s named US production locations include Chandler, Rio Rancho and Hillsboro. Its network also includes Leixlip in Ireland and Jerusalem and Kiryat Gat in Israel. Intel’s count of 15 production wafer fabs at 10 worldwide locations was stated on a page last reviewed February 6, 2025. That is a company-wide count, not a list of 15 US fabs.
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Samsung: South Korea and Texas
Samsung Foundry names Giheung, Hwaseong and Pyeongtaek in South Korea, plus Austin and Taylor in Texas. Samsung specifically describes Hwaseong as producing 10 nm-to-3 nm processes and Pyeongtaek as mass-producing advanced nodes. Those descriptions identify capabilities Samsung attributes to its own sites; node labels alone do not establish a like-for-like ranking of output or performance across companies.
What do “leading” and the headline capacity figures mean?
“Leading” can refer to process capability, wafer capacity, commercial importance or the reach of a manufacturer’s network. The available figures use different scopes and units, so they should not be read as a league table.
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- TSMC: its 2025 annual report says facilities managed by the company and its subsidiaries had annual capacity exceeding 17 million 12-inch-equivalent wafers in 2025. This is a company-wide managed-capacity figure, not a single-fab figure.
- Intel: the company stated it had 15 wafer fabs in production at 10 locations worldwide on a page last reviewed February 6, 2025. This is a count of fabs and locations, not a wafer-capacity measure.
- UMC: its Fab Information page identifies 12 fabs in production across Asia, including four advanced 12-inch fabs, and names Fab 12i in Singapore. This is a different company count and scope from Intel’s; it should not be directly compared with TSMC’s capacity figure.
These measures answer different questions. A capacity number is not a site count, and a site count does not establish how much each site produces. Nor does a process-node label by itself provide a standardized measure of output or performance.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.How to read fab locations and project announcements
Semiconductor facilities can be operating, ramping, installing equipment or under construction. Those are materially different stages. For example, TSMC’s Arizona disclosures distinguish first-facility volume production from later facilities installing systems or under construction; its Japan reporting distinguishes the first Kumamoto fab’s production from construction of the second. Treating every announced location as an operating fab would overstate current manufacturing.
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Company disclosures are useful for identifying each operator’s own sites and project status, but they do not create a harmonized, independently audited global ranking. This overview also does not inventory every manufacturer or every fab; it focuses on representative networks named in the cited company material. For a broader site-by-site search, SEMI describes World Fab Watch as a searchable database of current and future front-end fabs, including location and wafer-size information.
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