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Where Are AMD Factories? A Guide to Its Manufacturing Network

AMD’s manufacturing network relies on named foundries and Asia-Pacific packaging partners. Its public filings distinguish those suppliers from corporate offices and do not map every product to a specific plant.
From TheFinanceBase Team3 min to read
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AMD’s disclosed chip manufacturing network is primarily made up of third-party suppliers, not a directory of AMD-owned factories. The company identifies foundries that fabricate wafers and Asia-Pacific partners that handle assembly, testing, marking, and packaging. Its offices—including its headquarters in Santa Clara, California—are separate from those manufacturing sites.

Does AMD own chip factories?

AMD’s FY2025 Form 10-K, filed February 4, 2026, describes external foundries and manufacturing partners. It does not identify a list of AMD-owned wafer fabrication plants. In this context, “AMD factory locations” is best understood as the locations of suppliers involved in making AMD products, rather than a network of AMD-operated fabs. AMD’s 2025 Form 10-K

Where are AMD’s corporate offices and operations?

AMD lists its headquarters in Santa Clara, California, and significant operations in Austin, San Jose, Shanghai, Markham, Longmont, Dublin, Singapore, Bengaluru, and Hyderabad. These are corporate property or operations disclosures, not a list of chip factories. The same filing reports about 6.8 million square feet of global space for research and development, engineering, administrative, and warehouse use as of December 27, 2025: about 5.4 million leased and 1.4 million owned. That figure describes corporate-use space, not factory floor area. AMD’s 2025 Form 10-K

Which companies fabricate AMD’s wafers?

AMD’s filing names suppliers by product category. The disclosures do not mean that every AMD product uses every supplier listed.

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Manufacturing stage or product category Supplier named by AMD What AMD discloses
HPC, FPGA, and adaptive SoC wafers TSMC AMD says it uses TSMC for wafers for these product categories.
HPC wafers at 12 nm and 14 nm GLOBALFOUNDRIES AMD identifies purchases of certain HPC wafers at these process nodes.
Programmable-logic-device ICs TSMC, UMC, and Samsung AMD names these suppliers for this category of ICs.

These are supplier and product-category disclosures, not exact plant addresses. AMD does not map each chip model or generation to a specific fab in the cited filing. AMD’s 2025 Form 10-K

Where are AMD chips assembled and tested?

Wafer fabrication is only one stage. AMD says wafers may be sorted at the foundry or sent to partners or subcontractors in the Asia-Pacific region for assembly, test, marking, and packaging. Its filing identifies two assembly, test, marking, and packaging joint ventures with Tongfu Microelectronics, and names SPIL and KYEC as service providers. It does not assign every AMD product to a particular partner plant, so the disclosure supports a regional partner network—not a product-by-product site map. AMD’s 2025 Form 10-K

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Does TSMC’s global footprint show where AMD chips are made?

No. TSMC’s 2025 annual report describes TSMC’s own network, including facilities in Taiwan and wafer fabs at TSMC Nanjing, TSMC Arizona, and Japan Advanced Semiconductor Manufacturing. It reports that capacity across facilities managed by TSMC and its subsidiaries exceeded 17 million 12-inch-equivalent wafers in 2025. That is TSMC-wide capacity—not AMD output, a capacity reservation for AMD, or proof that each listed site makes AMD products. AMD’s filing names TSMC as a supplier for specified product categories but does not identify the exact TSMC fab used for each product. TSMC’s 2025 Annual Report

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What can be said about AMD factory locations with confidence?

  • AMD identifies third-party suppliers for wafer fabrication rather than a list of AMD-owned chip fabs.
  • Its filing names TSMC, GLOBALFOUNDRIES, UMC, and Samsung for particular product categories and, for GLOBALFOUNDRIES, specified HPC wafer nodes.
  • It describes assembly, test, marking, and packaging partners or subcontractors in Asia-Pacific, including Tongfu Microelectronics joint ventures, SPIL, and KYEC.
  • The public disclosures cited here do not identify the fab or packaging plant for each AMD product model.

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