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In March 2000, Orient Semiconductor Engineering Inc. (OSE) reported a US$200 million plan to build two IC assembly and packaging plants near its headquarters in Kaohsiung, Taiwan. The company expected production to begin in late 2000 or early 2001. Those dates describe the plan reported at the time; they do not establish when the plants actually entered production.
What OSE announced in March 2000
EE Times reported on March 8, 2000, that OSE had begun a US$200 million expansion involving two plants near its Kaohsiung headquarters. The report framed the investment as an effort to expand the company’s back-end semiconductor capacity and strengthen its position against Taiwanese competitors ASE and Siliconware. Those competitive descriptions belong to the 2000 report, not to a current ranking.
OSE, then identified as Orient Semiconductor Engineering Inc., is now Orient Semiconductor Electronics, Ltd. The historical report also described OSE as operating in contract electronics manufacturing services (EMS) and said it had recently acquired a 75% stake in U.S.-based Integrated Packaging Assembly Corp. That acquisition is historical context, not part of the two-plant expansion announcement. EE Times, March 8, 2000
Which package types were planned?
OSE vice president Chen Ah-mei said that 30% to 40% of the new capacity would target ball grid array (BGA) packaging. The remaining capacity was intended for quad flat package (QFP) and small outline package (SOP) products. Chen said: “BGA is our target product, but we can support other package types as well.” These figures describe the planned capacity mix, not verified production or the eventual product mix. EE Times’ account of the package plan
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What was the expected production schedule?
The March 2000 report said production was expected to start in late 2000 or early 2001. It is a forecast reported at the time; the available account does not confirm the plants’ actual commissioning date or output. EE Times, March 8, 2000
Why was the expansion significant to Taiwan’s industry?
EE Times attributed to the Industrial Technology Research Institute (ITRI) in Hsinchu an increase in Taiwan’s IC packaging, testing and assembly industry revenue from US$1.9 billion in 1994 to US$3.6 billion in 1999. This is a historical statistic carried through the 2000 report; it is not a current market-size figure, and the underlying ITRI dataset is not independently established here. EE Times’ report of the ITRI figures
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How does the 2000 plan relate to OSE today?
OSE’s current profile identifies its IC Semiconductor group as an outsourced semiconductor assembly and test (OSAT) operation in Kaohsiung’s Nanzih Technology Industrial Park. The company describes assembly and testing services for consumer electronics, telecommunications, automotive, computing and industrial products, as well as an EMS business. Its listed offerings include flash memory cards, eMMC/eMCP/Flash BGA, lead-frame and CSP packages, and System in Package. These are company-listed B2B services and categories. OSE company profile · OSE services and products
OSE’s fiscal 2024 annual report said semiconductor assembly and testing declined that year, while EMS grew on AI-server orders. It also described development and validation work involving wafer-level and fan-out packaging. Those later business developments do not establish the outcome of the 2000 plants or connect that historical project to later facilities. OSE 2024 annual report
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Separate projects should not be confused with the 2000 expansion
OSE announced a separate assembly and testing facility in Kaohsiung’s Nanzih area in 2023. Its announcement said groundbreaking took place on May 9 and described a building with nine floors above ground and three below, exceeding 70,000 square feet. OSE projected completion in 2025 and 800 jobs; the announcement’s forecasts do not verify the eventual completion date or realized employment. OSE’s 2023 facility announcement
A further distinct example of Taiwan packaging investment is SPIL’s Yunlin project. Taiwan’s Ministry of Economic Affairs reported that SPIL broke ground there in September 2026, describing an investment of approximately NT$100 billion, CoWoS advanced packaging and planned operations beginning in 2028. It is a separate company, site, technology and project—not an update to OSE’s 2000 plan. Taiwan Ministry of Economic Affairs announcement
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