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In July 2009, Wacker Chemie announced that Siltronic would concentrate different silicon-wafer diameters at designated sites: 300 mm at Freiberg, 200 mm in Singapore and 150 mm at Burghausen. The plan was part of a broader restructuring that Wacker expected to reduce nearly 800 positions across Siltronic and WACKER SILICONES—not 800 wafer-production jobs. Wacker said the reorganization was not expected to reduce production capacity.
What “silicon production” meant in the 2009 announcement
The headline refers to silicon wafers made by Siltronic for semiconductor customers. It does not describe a cut in polysilicon production. Polysilicon was a separate business that Wacker said it continued to expand, while the job-reduction plan also included measures in WACKER SILICONES. These are distinct operations, even though all three appeared in coverage of the same company announcement.
EE Times published its report, “Wacker shifts silicon production, cuts jobs,” on 8 July 2009. Wacker’s announcement came amid difficult market conditions and described a reorganization of its production network.
Where Wacker planned to make each wafer diameter
| Wafer diameter | Designated lead site in the 2009 plan |
|---|---|
| 300 mm | Freiberg |
| 200 mm | Singapore |
| 150 mm | Burghausen |
Wacker said concentrating expertise by wafer diameter would make Siltronic’s network more flexible and improve utilization and cost structures. The site map was the plan announced in 2009; later company statements documented some transfers and qualifications, but do not establish that every detail was completed exactly as first proposed.
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- Wafer Pattern May Vary from the Product Images. Great to be used as gift, display object, exhibition, educating demonstration, testing, decoration or your collection
- Beautiful microchip pattern structure made by the advanced copper technology
- 90~130nm minimum microchip feature Copper Characterization with TEOS or Black Diamond Low-k ILD on the single crystal silicon wafer
- The original value of un-polished wafer is above $500
- No guarantee for research and other applications
How many jobs were involved—and where?
Wacker expected nearly 800 position reductions by the end of 2010 across Siltronic and WACKER SILICONES. EE Times described the figure as about 800 redundancies and explicitly noted that not all of the cuts were attributable to wafer production. It is therefore inaccurate to describe the announcement as 800 Siltronic wafer-factory jobs being eliminated.
Wacker’s release was titled “WACKER optimizes its global production network.” Its indexed headline included personnel director Sittenthaler’s statement that he saw a good chance of implementing the planned cuts without layoffs. The available wording does not establish the full context or outcome, so it should not be read as proof that no employees were laid off.
Rank #2
- Wafer Pattern May Vary from the Product Images. Great to be used as gift, display object, exhibition, educating demonstration, testing, decoration or your collection
- Beautiful microchip pattern structure made by the advanced copper technology
- 90~130nm minimum microchip feature Copper Characterization with TEOS or Black Diamond Low-k ILD on the single crystal silicon wafer
- The original value of un-polished wafer is above $500
- No guarantee for research and other applications
Did the shift reduce wafer capacity or interrupt supply?
Wacker said the reorganization would not negatively affect production capacity. Its 2009 annual report said customer qualification at the designated fabs was under way to help maintain uninterrupted supply. These were company expectations and plans; the available statements do not independently measure capacity or establish customer-supply results after the reorganization.
EE Times also reported an estimate of about €120 million ($168 million) in manufacturing-equipment write-offs associated with the changes. That was the estimate reported at the time, not a verified final expense.
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- 5 x 5 inches, 0.67 ounces, 0.03 inches thick. Some wafers are marked with alignment marks.
- The pattern is produced by light diffraction, and its reflective appearance changes with the viewing angle.
- Silicon wafers are fragile—please handle with care.
- Circuit details can be examined under a microscope.
What Wacker later reported about implementation
At the 2010 annual shareholders’ meeting, Wacker CEO Rudolf Staudigl said that 150 mm production had been discontinued at Freiberg and its volumes transferred to Burghausen. He also said customers were being qualified for 200 mm and 300 mm production in Singapore. This update adds implementation detail to the 2009 plan, but it does not show that every original site assignment or transition proceeded unchanged.
The episode is a historical account of a production-network announcement and its follow-up. It does not establish Wacker’s current employment levels, wafer capacity, operating-site assignments or product availability.
Quick Recap
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- Durable Design: Crafted from high-quality, transparent plastic for long-lasting use and easy visibility of contents.
- Single Wafer Capacity: Accommodates one 12-inch silicon wafer, providing secure storage and transportation.
- Protective Features: Raised edges and secure locking mechanism help prevent wafer damage during handling.
- Compact Size: Lightweight and portable, making it convenient for lab use or transportation.
- Versatile Application: Suitable for various industries utilizing silicon wafers, such as semiconductor manufacturing.
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- Multiple Diameter Options: Available in multiple diameters including 1, 2, 3, 4, 5, 6 and 8 inch silicon wafers
- Durable Substrate Design: Flat and solid silicon substrate supports cutting, polishing and controlled experimental handling
- Research and Educational Applications: Commonly used in laboratories, universities, research institutes and educational environments
- Precision Polished Wafer Surface: Manufactured with smooth and stable wafer surfaces, available in SSP (Single Side Polished) and DSP (Double Side Polished) configurations for sample preparation, handling, and laboratory processing.
- Wide Laboratory Applications: Commonly used in universities, research institutions, material science laboratories, and scientific training programs for silicon material studies and experimental demonstrations.
Sources
- EE Times, “Wacker shifts silicon production, cuts jobs” (8 July 2009)
- WACKER Annual Report 2009, “SILTRONIC”
- WACKER, “WACKER optimizes its global production network” (8 July 2009)
- WACKER, 2010 annual shareholders’ meeting speech
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