Texas Instruments announced plans on June 18, 2025, to invest more than $60 billion across seven U.S. semiconductor fabs at sites in Texas and Utah. The company called it the largest investment in foundational semiconductor manufacturing in U.S. history; that is TI’s characterization, not an independently verified ranking. The plan is a multiyear corporate investment, not a single federal grant. Since the announcement, TI has reported that its Sherman SM1 fab began production on December 17, 2025.
How much is TI investing, and what does the total cover?
TI’s June 2025 announcement put its planned investment at more than $60 billion for seven fabs across three U.S. manufacturing sites. A separate figure in the announcement—up to $40 billion—applies to four fabs at the Sherman, Texas, site. These are company investment plans; they should not be added together because the Sherman amount is part of the broader plan.
As an Amazon Associate I earn from qualifying purchases.
The federal figure is different in both source and scope. The U.S. Department of Commerce lists up to $1.61 billion in direct CHIPS and Science Act funding for TI. Commerce says the supported projects involve more than $18 billion in investment through the end of the decade across three facilities in Texas and Utah. That award-supported project scope is not the same as TI’s seven-fab, $60-billion-plus corporate plan.
Free tools Windows power users keep installed
One-click scans. No signup required.
| Figure | What it covers | Source and qualification |
|---|---|---|
| More than $60 billion | TI’s seven-fab U.S. plan across three sites | TI announcement, June 18, 2025; corporate plan |
| Up to $40 billion | Four fabs at Sherman, Texas | TI announcement, June 18, 2025; included within the broader plan |
| Up to $1.61 billion | Direct federal CHIPS and Science Act funding | U.S. Department of Commerce project listing, accessed 2026; supports a narrower set of projects |
| More than $18 billion | Investment associated with the Commerce-supported projects through the end of the decade | U.S. Department of Commerce project summary, accessed 2026; distinct from TI’s broader plan |
Where are the seven fabs, and what is their status?
TI’s plan groups seven fabs across Sherman and Richardson, Texas, and Lehi, Utah. Their statuses differ: SM1 has begun production, while the other fabs range from underway or ramping to planned for future demand.
#1 Best Overall
- DEVELOPMENT PLATFORM: Texas Instruments C2000 MCU F280025C LaunchPad development kit for rapid prototyping and evaluation
- CONNECTIVITY: Features USB connection cable for programming, debugging, and power supply
- PROCESSOR: Built around the F280025C microcontroller, ideal for real-time control applications and digital signal processing
- DESIGN FEATURES: Red PCB board with comprehensive development capabilities and expansion headers for additional functionality
- COMPATIBILITY: Supports TI's development ecosystem with Code Composer Studio and other programming tools
| Site | Fabs in TI’s plan | Status reported by TI |
|---|---|---|
| Sherman, Texas | SM1, SM2, SM3, SM4 | SM1 began production December 17, 2025. SM2 was underway in June 2025. SM3 and SM4 were incremental plans tied to future demand. |
| Richardson, Texas | RFAB1, RFAB2 | TI described RFAB2 as ramping toward full production in June 2025. |
| Lehi, Utah | LFAB1, LFAB2 | TI described LFAB1 as ramping and LFAB2 as under construction in June 2025. |
For Sherman SM1, TI said production would ramp according to customer demand and that the fab would ultimately produce tens of millions of chips daily. That is a stated eventual scale, not a report of current daily output. TI’s earlier June announcement had described initial production as expected during 2025; the December update superseded that prospective wording with a reported start date.
What kind of chips will the fabs make?
The plan centers on analog and embedded processing chips, often called foundational semiconductors. Commerce identifies power-management integrated circuits, microcontrollers, amplifiers, and sensors as examples of these current-generation and mature-node components. They support a wide range of electronic systems rather than serving only one consumer device category.
Rank #2
- 8051 compatible core with 4 clocks per instruction cycle
- 32K bytes of FLASH program / data memory, (endurance 1 million cycles)
- 1280 bytes of static data RAM
- Precision 8 differential or single-ended channels with 24-bit Analog-Digital-Converter (ADC)
- Quad 16-bit monotonic Digital-Analog-Converter (DAC) One PGA (Programmable Gain Amplifier), gain from 1 to 128 Additional 32-bit accumulator
For the projects covered by Commerce’s award listing, the agency describes planned 65nm–130nm analog and embedded chips at Sherman and 28nm–65nm analog and embedded chips at Lehi. These process ranges describe those supported projects; they do not mean the fabs are making the most advanced logic processors.
TI has cited vehicles, smartphones, data centers, satellites, medical devices, industrial robots, and smart-home appliances as applications for the kinds of chips involved. TI also named Apple, Ford, Medtronic, NVIDIA, and SpaceX as partners. The announcements do not disclose contract values or detailed product allocations, so the named relationships should not be read as a public accounting of supply commitments for each fab.
Rank #3
- 【ACEBOTT ESP32 Development Board】 - Powerful WiFi and wireless development board, driven by the rugged ESP 32 module, seamlessly integrated with Arduino IDE. With Hall sensors, high-speed SDIO/SPI, UART, I2S and I2C, it is the cornerstone of IoT and smart home innovation.
- 【Wi-Fi/Bluetooth and Arduino Cloud Compatibility】 - This board uses 2.4GHz dual-mode WiFi and wireless chips with low-power technology, which are RoHS-compliant, simplifying wireless communication and allowing you to easily connect devices and platforms. Whether you are using a compatible Arduino IDE or exploring other development environments, our board can easily adapt to your needs.
- 【Improved and Professional Edition】 - All IO pins are brought out for easy development; no additional breadboard is required; the Type-C interface is equipped with electrostatic discharge protection diodes and transient voltage suppression diodes to protect the chip from damage by electrostatic breakdown and various surge pulses. In addition, it is equipped with a freeRTOS operating system, which is very suitable for the Internet of Things, smart homes, and building smart robots/game consoles.
- 【Easy to Use】- The ACEBOTT ESP-32 Development Board includes everything you need to support the microcontroller. Just connect it to a computer via a USB cable or use an AC-DC adapter or battery to power it to start using it. Whether you are an experienced developer or a hobbyist, this development board can provide you with the tools you need for unlimited innovation.
- 【 Install Plugins And Download Drivers】: This ESP32 development board includes detailed instructions on how to download plugins and all necessary programs and codes from the network environment. The path is: ACEBOTT official website - Resources - WIKI.
What job figures have been announced?
TI said its combined new manufacturing mega-sites would support more than 60,000 U.S. jobs. Separately, Commerce estimates that the narrower set of supported projects will create more than 2,000 manufacturing jobs and over 20,000 construction jobs over time. These are projections or jobs supported, not counts of positions already filled, and the two figures cover different scopes.
TI’s press materials also describe hundreds of millions of chips manufactured daily across its operations. That is a company-reported figure, not a measurement of output from the new fabs alone. For Sherman SM1 specifically, TI’s stated tens-of-millions-per-day figure refers to the fab’s eventual capacity as it ramps with customer demand.
Rank #4
- Frequency: 1 GHz Maximum RAM Capacity: 512 MB Installed RAM: 512 MB Operating Supply Voltage: 5 V Interface Type: Ethernet, GPIO, I2C, Micro USB, SPI, UART Dimensions: 126 mm x 76 mm x 24 mm Packaging: Bulk Description/Function: BeagleBone green Product Type: Single Board Computers
Why TI describes the investment as historic
TI’s claim is tied to the scale of its announced investment in foundational semiconductor manufacturing in the United States. The plan spans three sites and seven fabs rather than one facility, and the Sherman portion alone is described as up to $40 billion for four fabs. No independent ranking in the available announcements verifies the “largest in U.S. history” superlative, so it is most accurate to attribute it to TI.
What’s actually slowing this PC down?
Pick the symptom - the matching free tool is one click away.
The scale also has a longer history at Sherman. At the site’s May 2022 groundbreaking, TI described a potential $30 billion investment for four fabs and expected first production in 2025. That was an earlier, site-specific potential figure. It should not be substituted for the later $60-billion-plus plan, which covers multiple sites; TI subsequently reported that SM1 production began in December 2025.
Quick Recap
Sources and how to read the claims
- TI’s June 18, 2025 announcement sets out the seven-fab plan, investment and company employment figures.
- TI’s December 17, 2025 update reports the SM1 production milestone and its eventual output scale.
- The Department of Commerce/NIST TI project page describes the narrower federal award scope, planned process ranges, and project employment estimates.
Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.
