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Yes. NVIDIA uses Taiwan Semiconductor Manufacturing Company (TSMC) as a foundry to manufacture semiconductor wafers, and NVIDIA says it uses TSMC’s CoWoS packaging technology. NVIDIA designs its chips; it does not own TSMC or manufacture every product itself. Its filings also name Samsung as a foundry, so TSMC is a key supplier—not the only possible source for every NVIDIA chip.
What NVIDIA does—and what TSMC does
NVIDIA is a fabless semiconductor company: it develops chip designs, computing platforms, interconnects and software, then contracts with outside companies for manufacturing. In its fiscal 2026 Form 10-K, NVIDIA says it uses foundries including TSMC and Samsung Electronics to produce semiconductor wafers. It also describes relying on independent subcontractors and contract manufacturers for assembly, testing and packaging of finished products. NVIDIA fiscal 2026 Form 10-K
The distinction matters: designing a GPU or AI accelerator is not the same as fabricating its silicon. A foundry turns a design into wafers; packaging combines chips and other components into usable units; assembly and testing prepare components or systems for shipment. NVIDIA coordinates and specifies products across that chain, while specialist suppliers perform many of the physical manufacturing steps.
Where TSMC fits in NVIDIA’s supply chain
TSMC is one of NVIDIA’s wafer foundries and a major manufacturing partner for its advanced products. The precise production path can differ by chip and generation. NVIDIA’s public filing names both TSMC and Samsung but does not provide a complete product-by-product map of which foundry makes each chip. It would therefore be inaccurate to say that TSMC makes every NVIDIA product.
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The broader supply chain involves additional companies and distinct roles. NVIDIA identifies SK Hynix, Micron and Samsung as memory suppliers, and names Hon Hai/Foxconn, Wistron and Fabrinet among the subcontractors and contract manufacturers involved in assembly, testing and packaging of final products. These roles should not be confused with wafer fabrication by a foundry. NVIDIA fiscal 2026 Form 10-K
Why CoWoS packaging matters
CoWoS—Chip-on-Wafer-on-Substrate—is an advanced packaging technology associated with TSMC. NVIDIA says it uses CoWoS for semiconductor packaging, and TSMC includes CoWoS in its advanced packaging and 3D chip-stacking portfolio. TSMC 2025 Annual Report
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Packaging is especially important in high-performance AI systems. An accelerator may need to bring compute silicon and high-bandwidth memory together in a package with demanding bandwidth and power-delivery requirements. As a result, having enough advanced packaging capacity can affect how quickly finished accelerators can ship, even when wafer fabrication is available. Public disclosures cited here establish NVIDIA’s use of CoWoS, but do not establish a specific share of TSMC’s CoWoS capacity allocated to NVIDIA.
Which NVIDIA products are associated with TSMC?
NVIDIA’s major product families include Hopper and Blackwell data-center GPUs, GeForce RTX 50-series graphics products based on Blackwell, Grace Blackwell systems and the announced Vera Rubin/Rubin platform. These examples illustrate the range of NVIDIA products and systems, not a confirmed foundry assignment for each individual SKU. NVIDIA’s filing establishes the company-level use of TSMC and Samsung, but does not disclose a complete product-by-product manufacturing breakdown. NVIDIA fiscal 2026 Form 10-K NVIDIA fiscal 2026 annual-report filing record
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What the Arizona Blackwell milestone means
On October 17, 2025, NVIDIA announced that the first Blackwell wafer had been produced at TSMC’s Arizona facility, describing the facility’s production as reaching volume production. NVIDIA characterized its relationship with TSMC as roughly three decades long. NVIDIA announcement on Blackwell manufacturing at TSMC Arizona
A U.S.-produced wafer does not by itself mean a finished GPU or server was made entirely in the United States. Wafer fabrication, advanced packaging, memory production, testing, board assembly and system integration may take place at different suppliers and locations. NVIDIA says its supply chain remains concentrated in Asia while it expands activity in the United States and Latin America; the Arizona milestone does not establish that all NVIDIA chips, or every Blackwell production step, are U.S.-based. NVIDIA fiscal 2026 Form 10-K
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Is this an ownership partnership?
No. In this context, “partnership” means a long-running manufacturing and technology relationship. NVIDIA’s public disclosures describe suppliers and manufacturing arrangements; they do not indicate that TSMC owns NVIDIA, NVIDIA owns TSMC, or that the companies are one combined business.
The cooperation also extends beyond TSMC manufacturing NVIDIA products. In a June 1, 2026 announcement, NVIDIA said TSMC was using NVIDIA accelerated-computing systems and AI software—including CUDA-X libraries, AI models, Metropolis and TAO Toolkit—in work involving simulation, process control, fab optimization and defect inspection. That is a separate, two-way technology collaboration: TSMC manufactures chips for customers, and it can also use NVIDIA computing tools in its own operations. NVIDIA announcement on AI in semiconductor manufacturing
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- Protective PCB coating helps protect against short circuits caused by moisture, dust, or debris
- 3.125-slot design with massive fin array optimized for airflow from three Axial-tech fans
- Phase-change GPU thermal pad helps ensure optimal thermal performance and longevity, outlasting traditional thermal paste for graphics cards under heavy loads
Why the relationship matters to NVIDIA and its investors
Using a foundry lets NVIDIA focus its resources on architecture, software and systems rather than owning and operating leading-edge fabrication plants. It also gives NVIDIA access to specialized manufacturing and packaging capabilities. The trade-off is dependence on an external supply chain: wafer capacity, advanced packaging, memory, components and final assembly all have to be available in the right quantities and at the right time.
NVIDIA warns in its fiscal 2026 filing that its supply chain is concentrated and that securing supply during periods of growth can involve non-cancellable orders, premiums or deposits. Production can also be exposed to disruptions such as natural disasters, infrastructure shortages, logistics problems, export controls and supplier defects. For investors, the practical point is that strong demand for NVIDIA products does not alone guarantee that all manufacturing stages can scale at the same pace. NVIDIA fiscal 2026 Form 10-K
TSMC continues to invest in advanced process and packaging capabilities. Its 2025 annual report discusses volume manufacturing of its 2-nanometer technology beginning in the fourth quarter of 2025 and ongoing investment in CoWoS and other advanced packaging. Those company-wide developments show the broader manufacturing environment; they do not, by themselves, identify the process node or production allocation for a particular NVIDIA product. TSMC 2025 Annual Report
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