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IIC Shenzhen 2025 Concludes with Focus on Chip Innovation and Supply-Chain Networks

IIC Shenzhen 2025 brought semiconductor and component-industry participants together in Shenzhen on 25–26 November for discussions on supply-chain networks, AI, Industry 4.0 and distributor collaboration.
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IIC Shenzhen 2025 took place in Shenzhen on 25–26 November and concluded on 26 November. The two-day International IC & Component Exhibition and Conference brought semiconductor and component-industry participants together around supply-chain resilience, distribution, emerging technologies and smart manufacturing.

What IIC Shenzhen 2025 focused on

The event’s Global Distribution and Supply Chain Leaders Summit explored “The Diverse Ecosystem Pattern of Component Supply Chains” through two connected ideas: “Breaking Chains” and “Forming Networks.” The program considered how the component sector can move beyond fragile, isolated links toward broader cooperation across the supply chain.

A roundtable asked how artificial intelligence, the Internet of Things and big data could further empower distribution and supply-chain industries. The discussion included Alan Yan of Quiksol, Kevin Wang of Amble Electronics, Arthur Fei of Sigma, Dr. Moon-Kuen Mak of Puli Consulting and Totti Jiang of Ruifan Micro.

Who took part in the summit

Jiguo Zhou, chairman of the Electronic Components Application and Supply Chain Branch of CIITA (ECAS), delivered the opening address. Listed speakers included representatives from distribution, technology and logistics organizations:

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  • Alan Yan of Quiksol
  • Bertier Luyt of Adesio
  • Priyasha Sharma of Seedst International
  • Ken Liu of Heilind Asia Pacific
  • Grayson Li of Richardson RFPD
  • Echo Zhao of AspenCore
  • Dr. Moon-Kuen Mak of Puli Consulting
  • Richard Lu of DWIN Technology
  • Jiang Lei of ICS Superman
  • Vitalii Savryha of ARDl Logistics, Ardi Express and Stealtho

Exhibitors and technology on display

The curated exhibition featured companies spanning semiconductor technology, component distribution, sensing, industrial applications and engineering technology. Named exhibitors included Keysight Technologies (China), SmartSens Technology (Shanghai), Quiksol Global, Sigma Technology Group, Shenzhen HJC Electronics, Shenzhen Kaixinda Technology, Shenzhen Ruifan Microelectronics, Shanghai YueYue Electronics, Vadas International, Biaoxin Technology Shenzhen, SHENZHEN GOCHEN TECHNOLOGY, Galaxy Semicon Group, SEEDST International, ICkey (Shanghai), Jiangsu Runic Technology, Shenzhen Sinox Electronics, Shenzhen HDY Technology, Hangzhou SDIC Microelectronics, OK Electronica, Shenzhen Iczoom, MEET International, LINKCOST and Beijing Jingyuxing Technology.

The event report describes the collective exhibits as showcasing products and technological achievements related to semiconductor trends and innovative solutions; it does not provide a company-by-company product catalogue or comparative performance data.

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Industry 4.0 forum connected chips to smart manufacturing

A parallel International Industry 4.0 Technology and Application Forum addressed robotics, industrial power supplies and sensors. Its perspectives came from specialists associated with MPS, ADI, Beijing Jingyuxing, Hangzhou SDIC Microelectronics and Dobot. These topics connect semiconductor components to factory-level applications, where sensing, power delivery and robotic systems are part of increasingly automated production.

Distributor awards recognized ecosystem contributions

The 2025 Global Electronic Component Distributor Awards recognized companies and individuals for expanding markets, strengthening distribution and supply-chain collaboration, and building ecosystems that create industry value. A Special Industry Contribution Award marked ESMC’s 40th anniversary.

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Yorbe Zhang, AspenCore’s Head of APAC and Head of Content, said that major global research firms projected double-digit semiconductor-industry growth in 2025, while the IC Design Branch of the China Semiconductor Industry Association expected China’s design sector to return to high growth that year. Zhang also stressed that growth differs across vertical markets and that companies face both opportunities and challenges. The event report does not name the research firms or provide an independently verifiable percentage, so the growth forecast should be understood as Zhang’s attributed statement rather than a specific measured result.

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What the event report does not establish

The published account does not give an attendance total, exhibitor count, complete award-winner roster or revenue figure. It documents the event’s stated themes and named participants, but does not quantify the business impact of the exhibition or establish which technologies or companies led the market.

For readers assessing semiconductor supply-chain developments, the event’s themes point to useful questions: what role a company plays in the value chain, how broadly it covers components or technologies, how it coordinates supply and resilience, whether it integrates AI, IoT or big data, and how its products serve smart-manufacturing uses such as robotics, sensing and industrial power.

Source: EE Times Europe’s report on IIC Shenzhen 2025.

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