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Scan for outdated or missing drivers - takes under a minuteDriver Scan →Clear out junk files and repair common Windows errorsFree Scan →Fix the driver behind crashes, sound loss and screen glitchesFind Drivers →Peregrine Semiconductor completed its acquisition of IDT’s wafer-fabrication facility in Sydney, Australia, on July 10, 2000. The purchase brought the site under Peregrine’s control, but the companies did not disclose the financial terms.
What Peregrine acquired from IDT
The acquired operation was Quality Semiconductor Australia, a wholly owned subsidiary of Integrated Device Technology (IDT) that operated the Sydney wafer fab. After the deal, Quality Semiconductor Australia became a wholly owned Peregrine subsidiary. By September 26, 2000, the site was operating under the name Peregrine Semiconductor Australia.
The change was therefore more than a purchase of equipment: Peregrine took control of an existing manufacturing operation. Its plan combined production of Peregrine’s own chips with continued foundry services for outside customers.
Why Peregrine wanted the Sydney fab
Peregrine planned to begin manufacturing its patented Ultra-Thin Silicon (UTSi) CMOS technology at the facility. The added capacity was intended to support highly integrated RF synthesizer and transceiver chips for wireless products. The company also planned to keep offering 0.50-micron CMOS foundry services, preserving the site’s role as a contract manufacturer.
#1 Best Overall
- Wafer Pattern May Vary from the Product Images. Great to be used as gift, display object, exhibition, educating demonstration, testing, decoration or your collection
- Beautiful microchip pattern structure made by the advanced copper technology
- 90~130nm minimum microchip feature Copper Characterization with TEOS or Black Diamond Low-k ILD on the single crystal silicon wafer
- The original value of un-polished wafer is above $500
- No guarantee for research and other applications
That combination mattered to Peregrine’s growth strategy: the company could use the fab for its own RF integrated circuits while continuing to serve foundry customers. At the acquisition announcement, CEO Stav Prodromou called the deal “a very significant milestone in the growth of Peregrine” and cited strong demand for high-performance communications ICs.
What was disclosed about the price?
Peregrine and IDT did not disclose the financial terms. There is no confirmed purchase price in the public announcements cited here, so a dollar figure should not be inferred from the transaction.
Rank #2
- Wafer Pattern May Vary from the Product Images. Great to be used as gift, display object, exhibition, educating demonstration, testing, decoration or your collection
- Beautiful microchip pattern structure made by the advanced copper technology
- 90~130nm minimum microchip feature Copper Characterization with TEOS or Black Diamond Low-k ILD on the single crystal silicon wafer
- The original value of un-polished wafer is above $500
- No guarantee for research and other applications
How the fab’s technology roadmap developed
The acquisition announcement described ongoing 0.50-micron CMOS foundry services and the planned introduction of UTSi production. In September 2001, ASML announced that its lithography, track and thermal systems would help upgrade the Sydney facility from 0.5-micron Class 10 to 0.25-micron Class 1 capability. Volume production was scheduled for the third quarter of 2001; that schedule was a target, not confirmation in the announcement that production began on time.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Later manufacturing milestones
Peregrine’s 2005 certification announcement included the Sydney wafer fab within the company’s ISO-9001:2000- and AS-9100-certified RF-IC design and manufacturing system. In 2007, Peregrine and OKI said that, combined, their manufacturing capacity was producing 2.5 million UltraCMOS devices per week. That later figure applied to the two companies collectively, not to the Sydney fab alone.
Quick Recap
Best Value
- Durable Design: Crafted from high-quality, transparent plastic for long-lasting use and easy visibility of contents.
- Single Wafer Capacity: Accommodates one 12-inch silicon wafer, providing secure storage and transportation.
- Protective Features: Raised edges and secure locking mechanism help prevent wafer damage during handling.
- Compact Size: Lightweight and portable, making it convenient for lab use or transportation.
- Versatile Application: Suitable for various industries utilizing silicon wafers, such as semiconductor manufacturing.
Rank #4
- Multiple Diameter Options: Available in multiple diameters including 1, 2, 3, 4, 5, 6 and 8 inch silicon wafers
- Durable Substrate Design: Flat and solid silicon substrate supports cutting, polishing and controlled experimental handling
- Research and Educational Applications: Commonly used in laboratories, universities, research institutes and educational environments
- Precision Polished Wafer Surface: Manufactured with smooth and stable wafer surfaces, available in SSP (Single Side Polished) and DSP (Double Side Polished) configurations for sample preparation, handling, and laboratory processing.
- Wide Laboratory Applications: Commonly used in universities, research institutions, material science laboratories, and scientific training programs for silicon material studies and experimental demonstrations.
Rank #3
- 5 x 5 inches, 0.67 ounces, 0.03 inches thick. Some wafers are marked with alignment marks.
- The pattern is produced by light diffraction, and its reflective appearance changes with the viewing angle.
- Silicon wafers are fragile—please handle with care.
- Circuit details can be examined under a microscope.
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