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Infineon and Wolfspeed expanded and extended their silicon-carbide wafer supply agreement on January 23, 2024. The multi-year capacity reservation covers 150 mm bare and epitaxial wafers, and Wolfspeed later disclosed an approximate total agreement value of $275 million. It is a 150 mm supply pact—not Infineon’s separate 200 mm manufacturing program.
What did Infineon and Wolfspeed agree to supply?
The companies expanded and extended a long-term agreement first signed in February 2018. The addition is a multi-year capacity reservation under which Wolfspeed will supply Infineon with 150 mm silicon-carbide (SiC) wafers. Wolfspeed’s investor-relations release specifies both bare and epitaxial wafers (Wolfspeed, January 31, 2024).
The releases do not state the reservation’s exact duration, annual wafer volumes, price per wafer, or whether the agreement is exclusive. Those terms cannot be inferred from the disclosed total value.
How much is the agreement worth?
Wolfspeed put the expanded agreement’s approximate total value at $275 million in its January 31, 2024 release. That is the disclosed value for the agreement as a whole, not an annual amount or a per-wafer price. The announcement does not provide a payment schedule or a breakdown by wafer type.
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Why 150 mm SiC wafers matter
Silicon carbide is used in power devices that manage electrical energy. The companies link SiC power solutions to electric vehicles, charging infrastructure, solar and other renewable energy, energy storage, industrial power supplies, and traction or variable-speed drives. They say more efficient energy conversion can enable smaller, lighter, and more cost-effective designs.
In the context of the pact, the multi-year capacity reservation is intended to support Infineon’s supply-chain stability as demand grows across those applications. Infineon CEO Jochen Hanebeck described the company’s approach as a multi-source strategy for access to a global, long-term supply of both 150 mm and 200 mm wafers (Wolfspeed announcement, January 23, 2024).
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The same release attributes a forecast of a $20 billion annual opportunity through 2030 to industry estimates cited by Wolfspeed. It is an attributed market opportunity estimate, not a measured value for this contract or an independently verified market-size figure in the announcement.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.How the pact relates to Infineon’s 200 mm plans
The agreement covers 150 mm wafers. Infineon’s move toward 200 mm SiC technology is a separate manufacturing effort, not a change in the size specified by this Wolfspeed pact. In a February 13, 2025 roadmap update, Infineon said it planned to release its first products based on 200 mm SiC technology to customers in Q1 2025. It also said production in Villach, Austria, and the 150 mm-to-200 mm transition at Kulim, Malaysia, were on track (Infineon roadmap update, February 13, 2025).
Do these 3 things before closing this tab:
1Fix the driver behind crashes, sound loss and screen glitches2Repair Windows errors before they cause bigger problems3Scan for outdated or missing drivers - takes under a minuteWafer diameter is one useful distinction when comparing supply announcements: this contract reserves 150 mm material, while Infineon’s roadmap describes its own 200 mm product and manufacturing transition. The 2025 update does not establish that the Wolfspeed pact itself supplies 200 mm wafers.
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