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Data Center News Roundup (September 2026): Chip Deals, Vacancies and Metal Foam

The latest data-center cycle combines expanded SiGe capacity for optical links, large power and compute transactions, Modine manufacturing vacancies in Wisconsin, and promising but conditional metal-foam cooling research.
From TheFinanceBase Team4 min to read
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As of late September 2026, data-center expansion is showing up in three different places: expanded semiconductor capacity for optical links, localized hiring to build cooling equipment, and laboratory work on metal-foam heat sinks. The commercial announcements describe capacity and jobs; the foam results are controlled experiments, not proof of a ready-to-install data-center product.

Latest chip and infrastructure deals

GlobalFoundries and Marvell expand SiGe capacity

Reuters reported on 17 September 2026 that GlobalFoundries and Marvell expanded a multi-year agreement to increase GlobalFoundries’ silicon-germanium (SiGe) capacity at its Burlington, Vermont, operation. The technology is used for high-speed optical connections, including pluggable optical transceivers, near-packaged optics and co-packaged optics.

“Our expanded collaboration with GF will help ensure we have the SiGe technology and manufacturing capacity to support the significant growth we see ahead,” said Robb Johnson, Marvell’s vice president of foundry technology.

The agreement is about manufacturing capacity for optical connectivity rather than a disclosed purchase of finished processors. The announcement did not state a transaction value.

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Power and compute capacity are also attracting large transactions

Data Center Knowledge’s September 2026 deals page lists the following headline transactions. Those figures are values shown in that deals listing; the page does not establish that they represent completed payments or the full economic terms of each agreement.

Transaction Value reported What it adds to the data-center buildout
Flex acquisition of EPC Power $4.4 billion Power-delivery capability
Core Scientific–AMD deal $14 billion Compute capacity
GlobalFoundries–Marvell expanded agreement Not stated (Reuters, 17 September 2026) SiGe manufacturing for optical-networking links

Taken together, the listings show that the infrastructure race extends beyond processor supply. Power equipment, computing capacity and the optical connections between systems are all being financed or contracted at large scale.

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Where data-center jobs are available

Modine is hiring in southeastern Wisconsin

Modine said on 23 September 2026 that it was continuing to hire for up to 300 positions in southeastern Wisconsin to support its data-center cooling business. The announcement is a specific local hiring plan, not a national or global estimate of data-center employment.

Item Reported detail Qualification
Openings Up to 300 positions Modine announcement, southeastern Wisconsin; ongoing hiring
Production assembler pay Starts at $23 per hour Second-shift premium is available; the announcement did not state the premium amount
Franklin facility 153,000 square feet Opened in September 2025 for Airedale data-center cooling systems

For someone evaluating one of these jobs, the practical questions are whether the posting is still open, which shift it covers, how the premium is calculated, and whether the role is permanent or tied to a production schedule. The announcement supplies the starting wage and facility context but not a complete benefits package, hiring deadline or eligibility rules.

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Can metal foam cool AI data centers?

Potentially, in the right cooling design—but current studies do not show that a generic foam block can be installed in a production AI data center. The 2026 papers below tested specific geometries, coolants and flow arrangements. Their results point to useful design options along with hydraulic and materials constraints.

Study Configuration tested Finding
Energy (2026) Metal-foam-assisted heat sinks in high-heat-flux data-center immersion cooling Lower thermal resistance was reported, but the pressure-drop penalty depended on the dielectric fluid and flow structure.
International Journal of Heat and Fluid Flow (2026) Metal foams with different pore densities and porosity A 5 PPI sample outperformed a 20 PPI sample for average-temperature reduction in the tested setup; an optimized porosity lowered base temperature by up to 16.7%.
International Journal of Heat and Mass Transfer (2026) Metal foam in impinging-jet electronic cooling Heat transfer improved, while porosity and jet spacing changed both heat-transfer performance and flow resistance.

Why the laboratory result does not transfer automatically

A foam that increases heat-transfer area can also make coolant harder to move. Engineers would need to validate at least:

  • Thermal resistance: the temperature drop from the device to the coolant under the intended heat load.
  • Pumping penalty: pressure drop and the additional pump power required by the foam’s pore structure.
  • Pore density and porosity: the tested 5 PPI result is not a universal rule; geometry changes the balance between heat transfer and resistance.
  • Coolant compatibility: the dielectric fluid or other coolant must remain stable and compatible with the foam and surrounding materials.
  • Validation environment: immersion, impinging-jet and other systems have different flow paths, so a result from one arrangement cannot be assumed for another.

What “metal foam heat sink” means for a buyer

“Metal foam heat sink” is an accurate consumer-facing description for generic electronics-cooling hardware. Such products should be treated as components for a specified device and airflow or liquid loop, not as evidence that an enterprise AI rack can be upgraded without engineering review. The studies establish performance in their test conditions; they do not establish commercial adoption rates or a mature market for standardized data-center foam modules.

How to interpret this data-center cycle

  • Job seekers: local manufacturing announcements can create tangible opportunities even when the broader industry headlines concern chips or cloud capacity. Check the exact plant, shift and wage terms in the live posting.
  • People following deals: a headline acquisition or multibillion-dollar contract signals where companies are directing capacity, but it is not by itself a personal investment recommendation or proof that a transaction has closed.
  • Facility operators: treat metal foam as an engineering option for testing. Require coolant, pressure-drop, reliability and thermal validation before considering deployment.

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