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What Murata showed at CES 2025
Murata’s CES display connected small electronic components to larger systems: communications equipment, electric vehicles, sensors and IT infrastructure. The company’s portfolio spans multilayer ceramic capacitors (MLCCs), low-temperature co-fired ceramic (LTCC) products, wireless modules, batteries, sensors and power solutions.
One example of component miniaturization was an 008004-size surface-mount device measuring 0.25 × 0.125 mm, as reported by EE Times in 2025. The example illustrates the scale Murata can reach; it does not mean that every CES product or application uses that size.
Murata describes its role as creating products and solutions that contribute to social progress. At CES, that ambition was presented through technologies aimed at connectivity, mobility and the growing power demands of computing.
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How Murata’s Vision 2030 organizes its business
Nakajima described Vision 2030 as a three-layer portfolio strategy. The layers move from established component products toward more application-focused offerings and new ways of delivering value.
| Layer | What it covers | Examples or focus |
|---|---|---|
| Standard products | Core components sold across many markets | MLCCs and LTCCs |
| Application-specific components | Products designed around the requirements of a particular system or use | Wireless modules, batteries, sensors and power solutions |
| New business models | Ways to provide solutions beyond selling a standalone component | Nakajima described this as a strategic layer; the interview did not specify a particular model |
The strategy matters because Murata is not presenting itself only as a supplier of commodity passives. Its stated growth applications include communications from sub-GHz through millimeter-wave frequencies, e-mobility and IT infrastructure. Each market creates different priorities: radio performance for communications, sensing and power for mobility, and reliability and thermal management for computing infrastructure.
How AI and vertical integration fit Murata’s manufacturing plans
Nakajima said AI can classify MLCC production failures by type. Historically, operators adjusted manufacturing protocols manually to address failures; Murata intends to progress toward automatic process adjustment. His description indicates a planned shift in how production responses are made, not a claim that all MLCC lines already operate autonomously.
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“Unfortunately, we still have some failures in the production of our MLCCs, but AI can classify the protocols depending upon the type of failure. Previously, our operator would manually adjust the manufacturing protocols to eliminate failures. In the near future, we will move to an automatic adjustment.”
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The AI effort sits within a vertically integrated manufacturing model. Nakajima said Murata sources materials and equipment internally, and linked control of ceramic particle size and furnace design to yield and production consistency. Machine vision and AI classification can help identify defects, while control over materials and process equipment gives the manufacturer levers to address their causes.
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Murata’s profile in EE Times reported more than 73,000 employees and revenue of ¥1.64 trillion in 2025. Those figures provide scale for the company described in the interview, rather than a measure of the performance of any particular product or AI system.
Why power modules matter for AI data centers
For IT infrastructure, Nakajima emphasized power modules and higher-reliability components. The point is that the data-center challenge is not simply making parts smaller: equipment must deliver power reliably while managing heat and electrical losses.
Murata’s iPaS concept places custom-designed capacitors and inductors close to a power module and chip. Shorter electrical paths are intended to reduce wiring losses. The design also addresses heat dissipation, impedance and routing of traces, which must be considered together when integrating power components near processors.
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iPaS is therefore best understood as a packaged, system-oriented approach to power delivery rather than a single passive component. Its intended benefits depend on how the components are designed and integrated into the target system.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.How Murata’s technologies serve communications, mobility and computing
Communications: filters for higher frequencies and wider bandwidth
Murata’s acquisition of Resonant added XBAR filter technology to its portfolio. EE Times described XBAR as intended for higher frequencies and wider bandwidths, with steep filter characteristics, high attenuation and low loss. These traits are relevant to demanding radio designs, though the interview does not assign a specific performance figure or product configuration.
Mobility: sensing for stable flight
Murata’s official CES announcement highlighted the SCH16T, a MEMS-based six-degrees-of-freedom (6DoF) sensor. It is designed to support stable flight control, with low temperature drift and a wide gyroscope measurement range. Murata says those characteristics support centimeter-level flight accuracy. This is a concrete example of a sensor technology aimed at mobility rather than a general claim about all drones or flight systems.
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IT infrastructure: reliable power and thermal design
For data centers, the interview’s emphasis falls on reliable components, power modules and close integration of passives with power-supply and chip designs. In this context, the value proposition is system-level power delivery and heat management, not miniaturization as an end in itself.
What the interview establishes—and what it does not
The interview and CES announcement outline Murata’s strategic direction and several intended technology benefits. They do not provide comparative test results showing how Murata products perform against competitors, quantify yield gains from AI, or specify the operating conditions and full system designs behind the iPaS and SCH16T claims. Readers should treat those benefits as company-described aims and capabilities, not independent comparative proof.
For context, the five useful distinctions when evaluating these technologies are whether an offering is a component or an integrated solution; the frequency and bandwidth it supports; its reliability and thermal requirements; how much manufacturing control the supplier has; and the application it targets, such as communications, mobility, robotics or data centers.
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