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Random freezes, missing sound and display glitches usually trace back to one bad driver. Find and replace yours safely.Free scan · under a minuteDongbu Electronics began foundry production in an operating 200 mm fab in 2001, then announced that it had broken ground on a much larger 300 mm facility. The proposed plant was not later documented as completed: DB HiTek’s company history records other production milestones, while a 2009 industry retrospective describes 300 mm fabs as an earlier ambition.
What Dongbu had operating when it announced the project
By June 8, 2001, Dongbu Electronics had been offering foundry services for about two months and was producing in a 200 mm wafer fab, according to EDN’s contemporaneous report. That existing production—not the proposed 300 mm plant—was the company’s operating manufacturing base at the time. EDN identified the existing 200 mm fab as being in the Eumsung area.
The distinction matters: the 300 mm announcement concerned a project under construction, not production capacity already available to customers. The report also refers to Seoul-area context, so its location descriptions should not be treated as proof that every reference identifies one identical project site.
What the announced 300 mm fab was supposed to deliver
Wesley Min, Dongbu’s chief operating officer, told EDN the planned facility was projected to cost $2.5 billion to $3 billion, target processes from 0.10 to 0.07 micron, and open in mid-2004. These were 2001 estimates and targets, not verified construction costs, achieved process capabilities, or an opening date that the plant ultimately met.
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Dongbu managers also reported a $310 million second financing round, bringing the company’s total capitalization to $750 million. Those figures describe the company’s financing at the time; they do not establish that the announced fab was fully funded or completed.
How the project fit Dongbu’s early foundry strategy
Technology plans
Dongbu’s startup process strategy included Toshiba technology and rights. The company also said it intended to develop its own process compatible with TSMC’s. That compatibility was Dongbu’s stated plan, not an independently verified technical assessment.
Services available alongside the expansion ambition
A separate practical step came in August 2001, when EDN reported Dongbu’s ShuttleChip multi-project wafer service. It let customers prototype 0.25-micron CMOS designs by sharing mask and process costs; Dongbu planned a 0.18-micron service for the fourth quarter of that year. The service announcement shows that the company was building foundry offerings even as its proposed 300 mm expansion remained a future project.
Did Dongbu build the 300 mm fab?
The available later history does not support saying that Dongbu completed the 300 mm plant announced in 2001. DB HiTek’s company timeline records Fab2 at the Sangwoo Campus as completed in 2000, commercial production there beginning in 2001, and commercial foundry production with a 0.13 μm process beginning in 2004. It does not record the proposed mid-2004 300 mm fab as completed.
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A 2009 EE Times retrospective characterizes 300 mm fabs as an earlier Dongbu HiTek aspiration and describes the company as operating two 8-inch fabs. It says Dongbu lacked the capital, resources, and customer base to compete with major foundries and later focused on analog and mixed-signal foundry markets. Taken together, the retrospective and company timeline indicate that the 2001 project did not become the 300 mm plant as announced.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.What the market forecasts tell us—and what they do not
Min told EDN he was optimistic about semiconductor and foundry markets and forecast a rebound in the fourth quarter of 2001 if the economy was strong. That was an executive’s forecast at the time, not evidence that a rebound occurred or that it made the fab project viable. Peter Hillen, Dongbu’s executive vice president of marketing and sales and president of its U.S. operations, described the downturn as a chance to assess conditions, saying, “We’d like to step into a raging market.”
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