NVIDIA is expanding AI-hardware production in the United States, but it is not building NVIDIA-owned chip factories. Instead, it is coordinating a partner network: TSMC fabricates wafers in Arizona, Amkor is expanding advanced-packaging capacity there, and Wistron and Foxconn are involved in assembling AI systems in Texas. The shift is real, but it localizes parts of a global supply chain rather than bringing the whole chain home.
What NVIDIA means by U.S. manufacturing
NVIDIA designs GPUs, CPUs, networking chips and AI platforms. It relies on outside companies to manufacture, package, test and assemble them. NVIDIA’s 2026 Annual Review continues to describe dependence on third-party manufacturers and suppliers, so this initiative is a partner-led sourcing strategy—not a move to become a conventional, vertically integrated chipmaker. NVIDIA’s 2026 Annual Review
The word “manufacturing” can refer to several distinct stages. A wafer made in Arizona is not necessarily a finished, packaged accelerator; a server assembled in Texas can still contain parts made around the world.
- Wafer fabrication: building transistor structures on silicon wafers.
- Packaging and testing: connecting dies and other components, then checking performance and function.
- System assembly: integrating accelerators, memory, networking and other components into servers or larger AI systems.
That distinction is why “U.S.-fabricated wafer,” “U.S.-assembled server” and “made entirely in America” are not interchangeable descriptions.
Free tools Windows power users keep installed
One-click scans. No signup required.
#1 Best Overall
- High-Performance AI Processor：The MS-02 Ultra features an Intel Core Ultra 9 285HX (24C/24T, up to 5.5 GHz, 13 TOPS NPU), delivering fast and efficient performance for AI inference, algorithm development, and media workloads. A PCIe x16 expansion slot supports desktop-class GPU upgrades for advanced model training and accelerated computing tasks. It's ideal for creators, engineers, and teams handling intensive parallel workloads.
- 4 × M.2 PCIe 4.0 + 4 × DDR5 SODIMM slots:Four DDR5 SODIMM slots support up to 256 GB of memory, while ECC helps maintain data integrity in mission-critical environments. Four PCIe 4.0 M.2 slots support up to 24 TB of storage, supporting RAID 0/1/5/10, combining high-speed performance with data protection. It allows for the creation of independent scratch disks, media libraries, and project drives, providing high-throughput for production workflows.
- PCIe & USB 4.0 v2: Up to three PCIe slots can be equipped, including a dual-slot x16 GPU. The main slot supports PCIe 5.0, meeting the needs of high-bandwidth creative and computing workloads. USB 4.0 v2 (80Gbps) supports high-bandwidth external storage and displays.
- Ultra-fast Networking: Wi-Fi 7 further enhances wireless performance with next-generation speeds and low-latency stability. Intelligent bandwidth switching optimizes throughput in different network environments, ensuring optimal performance for enterprise or local networks. Dual 25GbE ports (providing up to approximately 3.125 GB/s bandwidth, about 25 times faster than traditional 1GbE), enabling seamless large-scale file transfers and parallel computing. 10GbE and 2.5GbE ports, with support for Intel vPro technology, ensure enterprise-grade remote management and deployment flexibility.
- Server-grade thermal architecture: Utilizing a dedicated CPU/GPU airflow design, equipped with a 6-pipe dual-fan cooler, it maintains stable performance even under sustained loads, delivering up to 140W Turbo power while maintaining a 100W TDP, and operating with noise levels as low as 36 dB. An integrated 350W power supply ensures stable and reliable output for demanding computing tasks and fully loaded extended configurations.
Arizona: U.S. wafer production and a planned expansion
TSMC, not NVIDIA, operates the Arizona fabrication facilities. NVIDIA announced its first U.S.-produced Blackwell wafer with TSMC in October 2025, an important production milestone but not evidence that every Blackwell chip or system is made domestically. NVIDIA’s announcement of the first U.S.-made Blackwell wafer
TSMC announced in July 2026 that it intended to add $100 billion to its Arizona investment, bringing its announced total there to $265 billion. The plans described by the Arizona Commerce Authority include ten fabs, two advanced-packaging facilities and an R&D center. Those figures describe an announced future footprint, not ten operating fabs or $265 billion already spent. Arizona Commerce Authority summary of TSMC’s expansion announcement
TSMC’s U.S. expansion adds geographic diversity, but it does not replace its Taiwan operations or remove NVIDIA’s exposure to the broader international semiconductor supply chain. TSMC’s 2025 annual report
Why packaging matters as much as wafer production
Advanced AI accelerators rely on more than transistor fabrication. Multi-die integration, high-bandwidth memory, advanced substrates and precise electrical and thermal design all affect whether a wafer can become a usable, high-performance component. Packaging capacity can therefore constrain output even when wafers are available.
Do these 3 things before closing this tab:
1Repair Windows errors before they cause bigger problems2Scan for outdated or missing drivers - takes under a minute3Clear out junk files and repair common Windows errorsRank #3
- Professional AI & Creator Workstation: AMD Radeon AI PRO R9700 GPU with 32GB GDDR6 is engineered for AI development, professional content creation, and compute-intensive workloads.
- Massive 32GB Memory Capacity: 32GB of GDDR6 memory on a 256-bit bus provides ample bandwidth for large AI models, 8K video editing, and complex 3D rendering.
- Advanced RDNA 4 with AI Accelerators: 64 Compute Units with 3rd Gen Ray Tracing and dedicated 2nd Gen AI Accelerators for groundbreaking AI performance and visual computing.
- Professional Blower Cooling: Efficient single blower design exhausts heat directly out of the chassis, ideal for multi-GPU workstation and server configurations.
- Enterprise-Grade Thermal Solution: Vapor chamber heatsink with industrial Honeywell PTM7950 thermal interface material ensures reliable cooling under sustained professional loads.
In July 2026, Amkor announced a multiyear agreement with NVIDIA valued at $1.5 billion. Amkor said NVIDIA would provide a prepayment to support expansion of Amkor’s U.S. advanced-packaging capacity in Arizona. The agreement signals that packaging is a strategic part of the U.S. buildout; it does not establish that all NVIDIA accelerators are already packaged in the United States. Amkor’s announcement of its partnership with NVIDIA
Texas: assembling AI systems, not fabricating chips
Texas is focused on turning components into deployable AI hardware. Wistron opened its D1 AI facility in Fort Worth in July 2026. Wistron said the roughly $700 million facility built and mass-produced the first NVIDIA GB300 Grace Blackwell Ultra Superchip in the United States and is preparing to produce the Vera Rubin Superchip. These are system-manufacturing milestones; they do not mean the chips’ wafers or every component are U.S.-made. Wistron’s Fort Worth announcement
Rank #4
- FAST RUNS IN THE FAMILY — The 16-inch MacBook Pro with the M5 Pro or M5 Max chip brings next-generation speed and powerful on-device AI to personal, professional, and creative tasks. With all-day battery life, double the starting storage,* and a breathtaking Liquid Retina XDR display, it’s pro in every way.*
- BUCKLE UP — Along with a next-generation CPU, faster unified memory, and up to 2x faster SSD storage,* M5 Pro and M5 Max feature a more powerful GPU with a Neural Accelerator built into each core, delivering faster AI performance and on-device training capabilities. So you can blaze through demanding workloads at mind-bending speeds.
- BUILT FOR AI — Apple silicon, and every major component that powers it, is designed to run demanding on-device AI workloads like LLM inference and training. And Apple Intelligence helps you write, express yourself, and get things done effortlessly with groundbreaking privacy protections at every step.*
- ALL-DAY BATTERY LIFE — MacBook Pro delivers the same exceptional performance whether it’s running on battery or plugged in.*
- MACOS RUNS APPS FAST — All your go-to apps run lightning fast in macOS, including built-in apps like FaceTime and Messages. Plus, built-in virus protection and free software updates help keep your Mac running smoothly and securely.
Foxconn is also working with NVIDIA on advanced AI-server production in Houston. NVIDIA’s U.S. manufacturing overview tracks facilities at different stages, including operating, under-construction and announced sites; a map location should not be read as proof that a facility is already producing at full capacity. NVIDIA’s U.S. manufacturing overview
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.How much of the supply chain is becoming domestic?
| Supply-chain stage | U.S. progress | What remains uncertain or international |
|---|---|---|
| Design | NVIDIA designs its platforms and chips. | U.S.-based design is not the same as domestic manufacturing. |
| Wafer fabrication | Blackwell wafer production has begun at TSMC’s Arizona operation. | The sources do not establish the domestic share of NVIDIA’s total wafer output, production yields or capacity by product. |
| Advanced packaging and testing | Amkor and TSMC are developing Arizona capabilities; NVIDIA has announced an Amkor partnership. | Expansion plans do not show how much current NVIDIA output is packaged in the U.S. |
| Memory and other components | The sources do not establish that all required high-bandwidth memory or other components are U.S.-made. | Memory, substrates, equipment, materials and components remain part of a multinational supply chain. |
| AI-system assembly | Wistron’s Fort Worth facility is operating; Foxconn is working on Houston production. | U.S. assembly does not imply that the systems’ components were made domestically. |
The clearest description is partial localization with greater U.S. capacity. Domestic fabrication and system assembly can reduce some geographic concentration and logistics exposure, while overseas inputs and specialist suppliers remain important.
Best Value
- 【High-Performance APU】The MS-S1 MAX features an AMD Ryzen AI Max+ 395 APU, integrating a Zen 5 architecture CPU (up to 5.1GHz, 16C/32T, 64M L3 Cache), an RDNA 3.5 GPU, and an NPU (50 TOPS). The total system output is 126 TOPS. It provides powerful parallel computing capabilities for demanding AI workflows. It is ideal for running local LLMs, multimodal models, and computationally intensive tasks
- 【128GB UMA Memory】Equipped with up to 128GB of LPDDR5x-8000MT/s unified memory, it enables the CPU and GPU to access a shared, high-bandwidth memory pool with extremely low latency. Ideal for large-scale AI inference, 3D workloads, and complex timelines in video editing. It eliminates traditional VRAM bottlenecks, ensuring smoother data transfer during high-intensity computations. The UMA design maximizes performance stability under high loads
- 【Flexible Expansion】The MS-S1 MAX features USB4 V2 (up to 80Gbps), dual 10GbE LAN, HDMI 2.1 (up to 8K60), a full-length PCIe x16 expansion slot, and dual M.2 slots supporting up to 16TB RAID 0/1. Wi-Fi 7 provides stronger signal coverage and a more stable wireless experience. The slide-out design facilitates upgrades and maintenance. It easily adapts to personal, studio, or rack-mount enterprise environments
- 【High-Efficiency Cooling System】Utilizing an aerospace-grade aluminum alloy chassis, copper base plate, six heat pipes, dual turbine fans, and advanced PCM thermal conductive material, it maintains stable cooling performance even under continuous load. This system supports 130W continuous power and 160W peak power operation, with a built-in 320W power supply. It boasts multiple global certifications including CCC, FCC, UL, CE, and UKCA, ensuring stable and reliable operation in various environments
- 【Cluster Design】Two MS-S1 MAX units can be configured as a dual-unit cluster to run a large 235B Q4 model locally, achieving an output speed of 10.87 tok/s. Supporting 2U rack deployment, multiple MS-S1 MAX units can be cascaded into a distributed cluster to create a high-efficiency AI computing center. A cluster of four MS-S1 MAX units successfully ran a DeepSeek-R1 671B Q4 large model. A reserved cluster power-on interface allows for unified start-up and shutdown
What the $500 billion figure does—and does not—mean
NVIDIA says it and its partners plan to produce up to $500 billion of AI infrastructure in the United States over four years. This is a company-stated production ambition for partner-built infrastructure, not a $500 billion NVIDIA factory investment or a measure of chips fabricated domestically. The category can encompass broader infrastructure, including systems and associated equipment, rather than wafers alone. NVIDIA’s announcement about building AI infrastructure in America
What the move could change—and what it cannot guarantee
A wider U.S. footprint can diversify where some production happens and bring fabrication, packaging and system assembly closer to U.S. customers. It also fits demand for AI infrastructure and U.S. policy goals around domestic semiconductor capacity. But localization has trade-offs: U.S. facilities require substantial investment and must scale successfully, while a supply chain that still depends on foreign memory, materials, equipment and components remains exposed to disruption outside the United States.
The practical test is not the number of announced facilities alone. It is whether wafer output, advanced packaging and system assembly can expand in step, with the capacity and yields needed to deliver products reliably. The available announcements establish milestones and plans, but do not provide a complete accounting of U.S. production volumes, costs or the domestic share of NVIDIA’s supply chain.
What Rubin will show about the next phase
NVIDIA announced in 2026 that its Vera Rubin platform was ramping into full production. Separately, Wistron said its Fort Worth site was preparing to produce the Vera Rubin Superchip. Together, those statements show that Texas system manufacturing is being prepared for the next platform as well as Blackwell. They do not establish that Rubin wafers, packaging, memory and finished systems will all be produced in the United States. NVIDIA’s Vera Rubin production announcement
Quick wins for a faster PC:
Repair Windows errors before they cause bigger problemsFix Now →Scan for outdated or missing drivers - takes under a minuteDriver Scan →Quick Recap
Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.
