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“Hot 25: F.C.Tseng, Taiwan Semiconductor” is an EDN profile published on December 20, 1999. It portrays F.C. Tseng, then identified as president of Taiwan Semiconductor Manufacturing Co. (TSMC), as a key manufacturing-focused executive in Taiwan’s early semiconductor industry and TSMC’s development as a dedicated wafer foundry. The profile is a historical snapshot, not a current biography or account of TSMC today.
Read the original EDN profile.
Who was F.C. Tseng?
EDN described Tseng as an influential but comparatively low-profile figure at TSMC, whose better-known public leader was Morris Chang. The profile identifies Tseng as the company’s president in 1999. It refers to him as “F.C.” and does not establish his full name, later career, or current status; those details should not be inferred from the article.
The distinction in the profile is about visibility and emphasis, not a claim that Tseng alone founded TSMC or that Chang’s role was secondary. EDN presents the two men as central to the company’s early development, with Tseng especially associated with manufacturing and operations.
From ITRI to Taiwan’s early IC work
According to EDN, Tseng began his work in Taiwan’s semiconductor and electronics industry at the Industrial Technology Research Institute (ITRI). The profile says he helped pioneer Taiwan’s first integrated-circuit project in 1976. This account places him in the early institutional effort to build local capability in a field that would later become central to Taiwan’s technology industry.
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The article is the source for this biographical account; it does not provide independent documentation or further detail about the project.
How Tseng and Chang helped establish TSMC’s foundry model
EDN says Tseng partnered with Morris Chang in 1987 to establish TSMC as a dedicated wafer foundry. A pure-play foundry manufactures chips designed by other companies rather than primarily producing its own branded chips. For customers, the model offers access to semiconductor manufacturing without requiring them to own and operate a fabrication plant themselves.
The profile describes TSMC as serving chip designers and manufacturers. It also notes that, by 1999, the company was extending some services in response to customer requests, including design operations. That detail shows the practical tension in the model: specialize in manufacturing, while adapting at the edges when customers need more support.
Why Tseng put manufacturing first
The profile’s central theme is a debate about where Taiwan’s semiconductor industry should concentrate its effort: chip design or manufacturing. Tseng believed Taiwan had a stronger advantage in manufacturing. In EDN’s account, he stressed consistency and advanced technology, arguing that a dependable manufacturing base was essential to future success.
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That position did not make design unimportant. Rather, it treated manufacturing excellence as a strategic specialization: customers could design products while relying on a foundry to turn those designs into wafers with consistent processes. The profile connects Tseng’s view to TSMC’s focus on serving outside chip makers instead of competing with them primarily through its own chip designs.
What the 1999 profile says about technology and operations
The 0.18-micron copper process
EDN reported that TSMC had recently become the first pure-play foundry to formally offer a commercially available 0.18-micron copper process. This is a claim made in the article’s 1999 context, not a present-day technology comparison. The profile does not independently establish the claim’s scope beyond its wording.
Six foundries and a customer-facing role
At publication, EDN described TSMC as operating six foundries. It said Tseng was less involved in their daily operation because of his presidential responsibilities, but helped customers address wafer-sourcing and manufacturing problems. The picture is of an executive whose role combined strategic oversight with practical customer support—not simply a technical specialist working inside a fab.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Why the Singapore and multi-fab plans mattered
EDN said Tseng was directing more resources toward foundries outside Taiwan, including a facility in Singapore, and considering how to distribute business across different TSMC fabs. The article presents this as a plan and strategic direction at the time; it does not establish what became of every element.
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Tseng’s argument, as reported by EDN, was that customers could obtain wafers from multiple TSMC plants. The strategic idea was internal diversification: a customer could spread production across facilities while retaining one foundry relationship. That is different from using independent suppliers. Multiple sites within one company can provide alternatives, but they do not eliminate exposure to a disruption affecting the company broadly.
What the profile reveals about Tseng—and what it cannot tell us
EDN characterized Tseng as modest and soft-spoken and said he read Chinese history and literature to better understand human behavior. These personal details add texture to the profile, but they do not by themselves demonstrate how he managed or how much any single decision depended on him.
The article is most useful as a window into TSMC’s ambitions and operating questions in late 1999: how to build a manufacturing-focused business, serve customers reliably, and consider capacity beyond Taiwan. Its title, Tseng’s position, the six-foundry description, the Singapore reference, and the copper-process milestone all belong to that historical frame. The profile does not establish Tseng’s later career or TSMC’s present-day organization.
Source and date
EDN published “Hot 25: F.C.Tseng, Taiwan Semiconductor” on December 20, 1999. The historical claims in this article are attributed to that profile: https://www.edn.com/hot-25-f-c-tseng-taiwan-semiconductor/.
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