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Rohm and Haas Planned a $50 Million CMP Plant in Taiwan

Rohm and Haas announced a $50 million CMP polishing-pad plant and technology center in Taiwan in 2005; the company later said it had operated since March 2007.
From TheFinanceBase Team2 min to read
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Rohm and Haas Electronic Materials announced a $50 million combined manufacturing and technology center at Taiwan’s Chunan Science Park satellite campus in August 2005. The planned 45,000-square-foot facility was to make advanced chemical mechanical planarization (CMP) polishing pads, with commercial production then expected in the first quarter of 2007. The company later reported that the plant had been fully operating since March 2007.

What Rohm and Haas planned to build

The project was more than a production building. Rohm and Haas described it as a combined CMP manufacturing and technology center, with pad production, an applications laboratory, and sales and customer-support offices. The planned product was the next generation of IC1000 polishing pads, used in semiconductor wafer manufacturing.

The announcement called for a 45,000-square-foot plant. It did not describe the site as a slurry-production facility: the stated manufacturing focus was polishing pads.

Where the plant was located

The facility was planned for the Chunan Science Park satellite campus of Taiwan’s Hsinchu Science Park. Rohm and Haas positioned the site near semiconductor customers in Taiwan and elsewhere in Asia, so manufacturing, applications engineering, and customer support could be closer to foundries and other users as they built advanced 300 mm fabrication capacity.

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In the 2005 announcement, CMP Technologies president and CEO Nick Gutwein said, “With the majority of our business currently based in Asia, Taiwan makes the ideal location for our significant investment in this multi-purpose plant and technical center.”

Investment, production schedule, and later operating status

Item Reported detail
Announced investment $50 million for the combined manufacturing and technology center, announced in August 2005 (EDN, 2005).
Planned plant size 45,000 square feet (EDN, 2005).
Production forecast at announcement Commercial production was expected in the first quarter of 2007 (Evertiq, 2005).
Subsequent company-reported status In July 2008, Rohm and Haas said the Hsinchu plant had been fully operating since March 2007 and had passed certification by major local logic and memory customers (Rohm and Haas, 2008).

The expected first-quarter 2007 start was a forecast, while the March 2007 operating date was stated later by the company. The 2008 announcement also said the plant was designed for phased expansion to meet Asian demand for 200 mm and 300 mm polishing pads.

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Why the Taiwan location mattered

The stated rationale was customer proximity: production, technical applications work, and support would be located closer to a major base of Asian semiconductor customers. As foundries expanded advanced 300 mm operations, having an applications laboratory near customers could support process development and customer response alongside local pad manufacturing. The project was described at the time as CMP Technologies’ first major Asian CMP-pad investment outside Japan.

What was forecast about employment

Chemical & Engineering News reported in 2005 that the project was expected to employ more than 150 people by 2010. That figure was a forecast made when the facility was announced; the cited report does not verify the plant’s eventual headcount.

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What the announcement means in brief

Rohm and Haas announced a $50 million Taiwan CMP pad manufacturing and technical center in 2005, expected commercial production in early 2007, and later reported the plant fully operating from March 2007. Its described scope combined IC1000 pad production with laboratory and customer-support functions, with room for phased expansion for 200 mm and 300 mm markets.

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Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.

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