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Sam Altman’s meeting with Samsung already happened: on October 1, 2025, the OpenAI CEO met South Korean President Lee Jae-myung, Samsung Electronics Executive Chairman Jay Y. Lee and SK Chairman Chey Tae-won in Seoul. The resulting announcements described a strategic partnership focused chiefly on advanced memory and Stargate AI infrastructure—not a confirmed Samsung-built OpenAI processor.
What happened at the October 1, 2025 meeting?
The meeting took place at South Korea’s Presidential Office in Seoul. It was followed by announcements and letters of intent involving OpenAI, Samsung Electronics, Samsung SDS, Samsung C&T and Samsung Heavy Industries, as well as separate OpenAI arrangements with SK companies and South Korea’s Ministry of Science and ICT. OpenAI’s announcement and Samsung’s account describe a broad infrastructure effort rather than a single chip-manufacturing order.
What did Samsung agree to do?
Samsung Electronics was named a strategic memory partner for OpenAI’s Stargate infrastructure. The companies also discussed semiconductor solutions, including advanced packaging and integration of memory with system semiconductors. Samsung’s broader capabilities include memory, logic, foundry and packaging, but the specific role announced for OpenAI was strategic memory supply. Samsung Semiconductor’s announcement describes those capabilities and the collaboration.
The agreement language matters. The announcements refer to letters of intent, memoranda of understanding and potential partnerships. Those terms do not, by themselves, establish a final purchase contract, binding delivery schedule, price or production commitment.
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Other Samsung workstreams
- Samsung SDS: The companies would explore designing, developing and operating AI data centers, alongside enterprise AI services.
- Samsung C&T and Samsung Heavy Industries: The companies were included in discussions about additional data-center capacity and related infrastructure.
OpenAI also said it and SK Telecom would explore an AI data center in South Korea, while OpenAI and the Ministry of Science and ICT would evaluate opportunities outside the Seoul metropolitan area. These plans were described as exploration or evaluation, not as completed facilities with announced operating dates. OpenAI’s announcement sets out the Korean data-center workstreams.
What does the 900,000 figure mean?
OpenAI cited projected demand of up to 900,000 DRAM wafer starts per month. That is a projected supply-chain requirement, not a count of finished AI processors or packaged memory products delivered each month. The announcement does not establish that the entire figure is Samsung’s allocation; SK hynix was also named as a memory partner. OpenAI’s announcement gives the figure and its wafer-start unit.
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- A wafer start is a wafer entering semiconductor manufacturing.
- A wafer can yield multiple dies, depending on its size, the manufacturing process and the dimensions of each die.
- Manufacturing yield, testing, dicing, packaging and product qualification come after a wafer enters production. Wafer starts therefore cannot be converted directly into monthly shipments without further information.
Does this mean Samsung is making OpenAI’s own AI chip?
That has not been established by the public announcements. The announced Samsung role clearly includes strategic memory supply and leaves room for broader semiconductor cooperation, but the announcements do not name an OpenAI-designed accelerator that Samsung agreed to manufacture. Samsung’s ability to make logic chips or provide foundry and packaging services does not prove that OpenAI selected it to fabricate a custom processor.
“AI chip” can refer to different components in a data center:
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- AI accelerator: The processor that performs the calculations used for model training or inference.
- DRAM and high-bandwidth memory (HBM): Memory used to store and rapidly feed data to processors. HBM is designed for high bandwidth and is used close to accelerators.
- Foundry manufacturing: Producing a chip according to another company’s design.
- Advanced packaging: Integrating processors, memory and other components into a package that can work as a system.
A company can supply critical memory or package components for AI systems without manufacturing the accelerator itself. The 2025 announcements do not confirm a named OpenAI processor, an OpenAI-specific Samsung foundry order, or a finalized manufacturing schedule.
Why does OpenAI need memory and infrastructure?
Stargate is OpenAI’s large-scale compute-infrastructure effort. Operating AI data centers requires more than accelerators: it also depends on memory, networking, power, cooling, buildings and the systems that connect them. Memory is a complementary bottleneck because processors need fast access to data while training or serving models.
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The Samsung announcement should be read as one part of that wider effort, not as the whole Stargate chip plan. OpenAI’s other infrastructure announcements have included partnerships with Oracle and other data-center and technology companies. In April 2026, OpenAI said Stargate had surpassed its original commitment to secure 10 gigawatts of U.S. AI infrastructure by 2029. That was an infrastructure milestone, not a Samsung-specific chip-delivery target. OpenAI’s April 2026 update describes the broader progress, while its Oracle partnership announcement illustrates the wider Stargate ecosystem.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Where does SK hynix fit?
SK hynix was announced as another major OpenAI partner. Its role includes advanced memory and support for OpenAI’s GPU-procurement strategy. The Seoul announcements therefore involved both South Korea’s leading memory suppliers, rather than Samsung alone. SK Group’s account describes its OpenAI arrangement and related infrastructure plans.
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The public announcements do not specify how the projected memory demand is divided between Samsung and SK hynix, or whether every product category is covered by both arrangements. They also do not disclose product-level allocation, delivery timing or pricing.
What is known about the partnership now?
The public information cited through July 2026 does not verify that the 2025 Samsung–OpenAI letter of intent became a fully specified, publicly disclosed production contract. On July 24, 2026, Reuters reported a Samsung memorandum of understanding with Broadcom covering memory, foundry and advanced packaging, and said OpenAI was among companies discussing future memory demand with South Korean suppliers. That report is not evidence of a new Samsung–OpenAI custom-chip agreement. The Reuters report syndicated by Fidelity concerns those later developments.
Several details remain undisclosed in the cited announcements: the exact memory products, any product-specific allocation, contract terms, pricing, qualification status and delivery schedule. A later announcement naming an OpenAI accelerator, a Samsung manufacturing order or a binding supply agreement would be needed to substantiate claims that Samsung is making OpenAI’s own processor.
Quick Recap
What to watch for next
- A disclosed binding supply agreement that clarifies products, volumes and timing.
- Announcements naming Samsung memory products or HBM generations for OpenAI infrastructure.
- Qualification or mass-production updates tied specifically to OpenAI.
- A named OpenAI accelerator design and confirmation of Samsung foundry or packaging work on that design.
- Construction and operating milestones for Korean data centers, beyond exploratory plans.
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