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One free scan finds every outdated or missing driver and matches the right update for your exact hardware.Free scan · exact hardware matchTSMC invested €838 million for a 5% stake in ASML in 2012 and committed another €276 million over five years to ASML research and development. TSMC later sold all of its shares; the deal is not a current ownership stake. The latest TSMC-ASML relationship is a technology collaboration announced in September 2026, focused on next-generation EUV photomasks.
What did TSMC invest in ASML?
In 2012, Taiwan Semiconductor Manufacturing Company (TSMC) joined ASML’s Customer Co-Investment Program. TSMC announced that it would pay €838 million for 5% of ASML’s equity and provide a further €276 million over five years to fund ASML research and development. The equity purchase and R&D commitment were separate parts of the arrangement.
TSMC said the additional R&D funding was intended to secure and accelerate EUV development, improve existing optical lithography tools, and speed the deployment of new technologies for 450-millimeter wafers. ASML described the program’s purpose as securing and accelerating key lithography technologies. These were strategic industry investments in semiconductor manufacturing technology, not a consumer-facing product deal.
Does TSMC still own ASML shares?
No. TSMC’s 2017 annual report records that it acquired the shares on October 31, 2012, and had disposed of all of them by October 8, 2015. The same report says the committed R&D funding was fully paid by September 30, 2017. The equity stake and funding commitment are therefore completed historical transactions, not evidence of a current TSMC ownership position.
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How the 2012 investment differs from the current collaboration
| Feature | 2012 investment | 2026 collaboration |
|---|---|---|
| What it was | Equity ownership in ASML plus a five-year R&D funding commitment. | Technology collaboration on 12-inch High-NA EUV photomasks. |
| Financial or ownership terms | €838 million for 5% of ASML, plus €276 million for R&D over five years. | Financial terms not stated in the September 8, 2026 announcement. |
| Status | Shares disposed of by October 8, 2015; R&D funding fully paid by September 30, 2017, according to TSMC’s 2017 annual report. | Future development targets: a 12-inch mask pilot line by 2031 and advanced-node production readiness by 2033. |
| Manufacturing horizon | Focused on accelerating lithography technology development, including EUV. | TSMC says it intends to use ASML High-NA technology in high-volume advanced-node manufacturing starting in 2030. |
What is the latest TSMC-ASML partnership?
On September 8, 2026, TSMC and ASML announced a collaborative initiative to develop 12-inch High-NA EUV photomasks. The companies target a 12-inch mask pilot line by 2031 and full lithography-system readiness for advanced-node production by 2033. Those are future targets, not completed capabilities.
TSMC says it plans to begin using ASML High-NA technology in high-volume advanced-node manufacturing in 2030. That planned use and the later photomask milestones describe related but distinct parts of the roadmap; the announcement does not say that the 12-inch mask pilot line will be operating in 2030.
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ASML CEO Christophe Fouquet said High-NA adoption is expected to progress first with current 6-inch masks and later with 12-inch masks, which he said could increase scanner productivity. TSMC Chairman and CEO C.C. Wei framed the collaboration as a way for the industry to tackle complex technical problems together. The announcement identifies collaboration on technology, not a new equity purchase by TSMC.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Why does this matter to TSMC?
Lithography is a central part of making advanced chips, and developing next-generation systems and compatible photomasks involves work across the semiconductor supply chain. The 2012 investment used both capital and committed R&D funding to support technology development. The 2026 announcement instead sets out joint development work and future milestones. In both cases, the relationship reflects cooperation between a major chipmaker and a supplier of lithography systems, but the structures and timelines are different.
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