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1Repair Windows errors before they cause bigger problems2Scan for outdated or missing drivers - takes under a minute3Clear out junk files and repair common Windows errorsNovellus Systems completed its acquisition of Gasonics International on January 10, 2001, and reorganized the company as its Surface Integrity Group. The all-stock transaction, valued in contemporaneous coverage at about $347 million, added wafer-cleaning and surface-preparation equipment to Novellus’ thin-film deposition business.
When did Novellus complete the Gasonics acquisition?
Novellus announced the deal’s closing on January 10, 2001, after Gasonics shareholders approved it on January 9. Gasonics’ Nasdaq ticker was scheduled to be removed after the January 10 close. The announcement was published in the Lam Research newsroom archive.
How much did Novellus pay, and how was the deal structured?
The merger was an all-stock transaction valued at about $347 million in contemporaneous coverage by EE Times. Novellus reported that approximately 9.24 million Novellus common shares were issued in exchange for Gasonics shares, while outstanding Gasonics options converted into approximately 1.4 million Novellus options.
What was the Novellus Surface Integrity Group?
After the acquisition, Gasonics became Novellus’ Surface Integrity Group, led by Executive Vice President Asuri Raghavan, who had been Gasonics’ president and CEO. Novellus also combined its metals and dielectrics divisions into a new Deposition Group, led by Executive Vice President John Chenault. The organizational changes were reported by EE Times on January 11, 2001.
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Why did Novellus buy Gasonics?
Novellus was known for thin-film deposition; Gasonics brought tools for removing photoresist and residues and preparing wafer surfaces, as well as low-pressure chemical-vapor-deposition systems for flat-panel displays. The acquisition therefore added process steps that complemented Novellus’ deposition portfolio rather than simply expanding the same product category.
The strategic case centered on increasingly demanding wafer preparation for copper dual-damascene manufacturing and geometries of 0.13 micron and smaller. Novellus chairman and CEO Richard Hill said that preparing the wafer surface before each deposition step was becoming more critical to manufacturing yields and device performance as interconnect structures shrank. In practical terms, cleaning and residue removal were positioned as integral to the quality of the subsequent deposition steps.
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What happened to Gasonics equipment after the acquisition?
Novellus continued to manufacture, sell, and support certain Surface Integrity Group products directly. In an October 19, 2006 announcement, it said that other selected used Novellus systems could be refurbished under license by Surplus Process Equipment Corporation (SPEC). The licensed list included the GaSonics VHP high-pressure oxidation system; the release said Novellus would continue direct manufacture, sales, and support for other 200 mm and 300 mm Surface Integrity Group products, including GAMMA and PEP IRIDIA. This describes the arrangement announced in 2006, not the present availability or support status of any particular tool.
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