Rexchip Electronics, the DRAM joint venture between Japan’s Elpida Memory and Taiwan’s Powerchip Semiconductor Corp. (PSC), held the grand opening of its first 300-mm wafer fab on October 12, 2007, at the Central Taiwan Science Park’s Houli site. The facility was running a 70-nm process, with volume shipments of 1Gbit DDR2 DRAM planned for the fourth quarter of 2007.
Where was the fab, and when did it open?
Rexchip held its grand opening on October 12, 2007, at the Houli site in Taiwan’s Central Taiwan Science Park. It was the first 300-mm fab operated by the Elpida–PSC joint venture.
What did Rexchip produce?
At opening, the fab was running a 70-nm process. Rexchip said it planned to begin volume shipments of 1Gbit DDR2 DRAM to Powerchip and Elpida in the fourth quarter of 2007. That announcement describes a planned product and shipment schedule, not proof that shipments began on that timetable.
The product was DRAM chip technology, not a consumer-ready RAM module. A 1Gbit DDR2 chip could be used in memory products, but the fab announcement does not identify a module maker, specific computer compatibility, or retail availability. DDR2 modules are a legacy format; anyone considering one for an older computer should verify the device’s supported memory generation, module type and capacity rather than relying on the chip’s capacity alone.
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How large was the joint venture and its planned expansion?
At the opening, Rexchip reported installed capacity of 30,000 300-mm wafers. This is the facility’s stated capacity at that point, distinct from the larger multi-fab ambition announced for the venture.
| Measure | Figure and meaning |
|---|---|
| Installed capacity at opening | 30,000 300-mm wafers; reported by Rexchip in 2007. The report does not specify a time period for this figure. |
| Longer-term planned capacity | 240,000 12-inch wafers per month across four planned fabs; reported in 2006 by Elpida and Powerchip. |
| Investment | More than $1.8 billion invested at Houli by opening, according to Rexchip in 2007. The broader venture plan was reported at about $13.7 billion in 2006–2007. |
| Workforce | More than 1,800 employees at opening, according to Rexchip in 2007. The broader plan called for more than 5,000 jobs. |
The four-fab, 240,000-wafer-per-month figure was a planned expansion, not the opening-day capacity of the single Houli fab. Rexchip’s first facility was part of a strategy announced in December 2006 to expand commodity-PC DRAM manufacturing.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Why did the opening matter?
For Elpida and Powerchip, Rexchip offered a way to expand DRAM manufacturing through a Taiwan-based 300-mm production site. At the opening, Elpida president and CEO Yukio Sakamoto described the 70-nm process as the company’s most advanced and said the venture could create a large, low-cost 300-mm DRAM fabrication base. PSC chairman and Rexchip chairman Frank Huang said the joint venture began operations less than a year after groundbreaking.
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