Samsung plans to spend more than $37 billion on its Central Texas chipmaking program, while TSMC says its intended U.S. investment totals $165 billion, centered on a major expansion in Arizona. The projects would add advanced logic-chip capacity, research facilities and, in TSMC’s case, advanced packaging in the United States. Both companies are receiving federal CHIPS Act support, but their investment totals, project scopes and job estimates are not directly comparable.
What are Samsung and TSMC building in the United States?
The two companies are developing different, complementary manufacturing clusters: TSMC in Phoenix, Arizona, and Samsung in Taylor and Austin, Texas. Both plans include logic-chip manufacturing and research and development. TSMC’s expanded U.S. plan also includes advanced-packaging facilities, which assemble and connect chips into products used in computing and other applications.
| Company and location | Planned investment | Announced facilities and role | Federal support described in the cited announcements |
|---|---|---|---|
| TSMC, Phoenix, Arizona | $165 billion in intended U.S. investment, announced March 4, 2025. The earlier Arizona plan was above $65 billion for three fabs. | Three additional fabs, two advanced-packaging facilities and an R&D center were included in the 2025 expansion announcement. The Arizona roadmap covers three fabs. | Up to $6.6 billion in direct funding and proposed loans of up to $5 billion under the November 15, 2024 award. |
| Samsung, Taylor and Austin, Texas | More than $37 billion for the Taylor campus plan, as described in Samsung Austin Semiconductor’s 2025 report on 2024 activity. | Two logic fabs and an R&D facility at the Taylor campus; the report also describes an Austin expansion. | Up to $4.745 billion in direct CHIPS funding, as recorded in Samsung Austin Semiconductor’s 2025 report on 2024 activity. |
The figures describe company investment plans and federal support, not equivalent measures of finished production capacity. TSMC’s $165 billion figure is its intended U.S. investment total; it should not be added to the earlier Arizona figure as though the two were separate commitments. Samsung’s more-than-$37-billion figure refers to its Central Texas campus plan, not a stated total for all Samsung investment in the country.
What is TSMC’s Arizona manufacturing timeline?
TSMC’s Arizona roadmap sets out different process targets for the three fabs. TSMC described the first fab as targeting 4-nanometer production in the first half of 2025. Its later releases describe that fab as having entered volume production in late 2024. That is a company-reported production status, distinct from the earlier target date.
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- First fab: TSMC’s April 2024 plan targeted 4nm production in the first half of 2025; the company later described it as in volume production since late 2024.
- Second fab: TSMC said it would target 2nm and 3nm technologies, with production beginning in 2028.
- Third fab: TSMC said it would target 2nm or more advanced processes by the end of the decade.
These are company-announced milestones, not a guarantee that every product using those processes will be made in Arizona or that all future dates will be met. TSMC’s March 2025 announcement adds three more U.S. fabs, two packaging facilities and an R&D center to the investment plan, but the cited announcement does not provide a comparable node-by-node schedule for each newly announced facility.
What is Samsung planning in Texas?
Samsung’s Taylor campus plan spans more than 1,200 acres and includes two logic fabs and an R&D facility. The company’s 2025 report on 2024 activity also describes an Austin expansion and says the Texas program is intended to supply chips for automotive, AI, consumer-technology, defense and aerospace uses.
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The cited report does not provide a production-node schedule comparable to TSMC’s Arizona roadmap. That means the available announcements support a comparison of facility types and investment plans, but not a claim that the two Texas fabs will make the same nodes, products or volumes as TSMC’s Arizona facilities.
How much federal CHIPS Act support are the companies receiving?
The federal support figures differ in form as well as size. For TSMC, the U.S. Department of Commerce’s November 15, 2024 award provides up to $6.6 billion in direct funding and proposed loans of up to $5 billion for the three-fab Arizona plan. “Up to” describes maximum support, and the loans were proposed rather than direct grant funding.
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Samsung’s 2025 report records up to $4.745 billion in direct CHIPS funding for its Texas expansion. The cited report gives that direct-funding figure; it does not state a comparable proposed-loan amount. These figures are not a simple comparison of cash already received: the announcements describe maximum award amounts and support terms, not the timing or amount of every payment.
What could the projects mean for U.S. jobs and chip supply?
The projects aim to locate more steps of advanced-chip production in the United States. Logic fabrication makes the chips themselves; advanced packaging connects and integrates components after fabrication. Having both kinds of capacity in the country could strengthen domestic supply options for AI and high-performance computing, as well as 5G and 6G, automotive, defense and consumer electronics. It does not mean the entire semiconductor supply chain—or every chip used in those industries—will move to the United States.
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The job estimates come from different sources and use different scopes, so they should be kept separate rather than ranked as if they measured the same thing.
- TSMC: The company says its March 2025 expansion supports 40,000 construction jobs over four years and tens of thousands of high-tech jobs. Separately, Commerce estimates about 6,000 direct manufacturing jobs and more than 20,000 unique construction jobs for the three-fab Arizona plan.
- Samsung: Samsung’s report projects up to 12,000 construction jobs and more than 3,500 direct manufacturing jobs within five years for its Texas program.
These are company or government estimates, not independently audited forecasts in the cited materials. Construction-job timeframes, direct-job definitions and the projects covered differ, so the figures do not establish which project will create more jobs on a like-for-like basis.
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What the announcements do—and do not—show
The announced plans show substantial private investment alongside federal support for U.S. advanced-chip capacity. TSMC’s public roadmap gives specific Arizona process milestones, while Samsung’s cited Texas report describes its facilities and intended industrial uses without a comparable node-by-node schedule. The cited materials do not provide a like-for-like comparison of the companies’ production yields, costs or commercial profitability, so they cannot establish which project will be more efficient or financially successful.
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