Short answer: TSMC has a growing manufacturing footprint in Arizona, Japan and Germany, but it has not moved away from Taiwan. The company reported more than 17 million 12-inch-equivalent wafers of annual capacity in 2025 and continues preparing advanced 2-nanometer fabs and advanced-packaging facilities in Taiwan. Overseas plants add geographic flexibility; the available disclosures do not show that they could quickly replace Taiwan output during a Taiwan Strait crisis.
How much of TSMC’s manufacturing is in Taiwan?
There is no reliable Taiwan-percentage figure in TSMC’s 2025 disclosures. The company reports a global annual manufacturing capacity of more than 17 million 12-inch-equivalent wafers for 2025, covering Taiwan and overseas operations. It does not provide a comparable site-by-site output table that would let readers calculate Taiwan’s share or estimate how much production could be transferred elsewhere.
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TSMC’s current capacity page describes six 12-inch GIGAFAB fabs in Taiwan, alongside fabs and facilities outside the island. Facility counts are not output shares: fabs differ in size, process technology, utilization and product mix. A simple count therefore cannot establish how many wafers, or how much leading-edge production, is located in Taiwan. See TSMC’s fab-capacity overview and its 2025 annual report for the company’s descriptions.
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TSMC reported 15.0 million 12-inch-equivalent wafer shipments in 2025, up from 12.9 million in 2024. It also reported 305 distinct process technologies and 12,682 products made for 534 customers. Those figures describe company scale and customer breadth, not geographic redundancy.
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Is TSMC moving advanced chip production out of Taiwan?
No. The 2025 annual report says TSMC is expanding globally while continuing to invest in Taiwan. It is preparing multiple phases of 2-nanometer fabs in Hsinchu and Kaohsiung and continuing advanced-node and advanced-packaging investment on the island.
TSMC says the reason for its broader footprint is customer demand for some geographic flexibility and the level of government support needed for major projects. C.C. Wei, TSMC’s chairman and chief executive, wrote in the 2025 annual report: “Part of this strategy includes expanding our global manufacturing footprint based on our customers’ needs, as they value some geographic flexibility, and a necessary level of government support.” That is the company’s stated business rationale; it is not a forecast that overseas plants can replace Taiwan in a military contingency.
Where TSMC is building and operating fabs
The following status and dates come from TSMC’s 2025 annual report, which covers the fiscal year ended December 31, 2025 and was filed in 2026. Construction and ramp schedules are company-reported and can change.
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| Location | Operating or planned status | Process or market information disclosed |
|---|---|---|
| Taiwan | Six 12-inch GIGAFAB fabs are listed on TSMC’s capacity page; preparations continue for multiple 2-nanometer fab phases in Hsinchu and Kaohsiung. | Leading-edge nodes and advanced packaging remain part of the Taiwan investment program. |
| Arizona, United States | The first facility entered high-volume production in the fourth quarter of 2024. The second was being equipped, with high-volume manufacturing targeted for the second half of 2027. Construction of a third began in 2025. | The broader announced U.S. plan includes three additional fabs, two advanced-packaging facilities and a major research-and-development team center; node details for the dated facilities are not stated in the cited report. |
| Kumamoto, Japan | The first JASM fab began volume production at the end of 2024. Construction of the second began in 2025. | The two-fab site is planned to offer processes spanning 40 nanometers through 3 nanometers for several end markets. |
| Dresden, Germany | Construction of a specialty-technology fab began in 2024. | The stated emphasis is automotive and industrial applications. |
| Nanjing, China | TSMC identifies a manufacturing facility in Nanjing as part of its overseas footprint. | The cited 2025 disclosures do not provide a directly comparable output figure for the site. |
These locations demonstrate more geographic reach, not an equivalent set of interchangeable plants. TSMC’s annual report is the source for the dated project descriptions and planned process ranges.
Can overseas fabs replace Taiwan production during a crisis?
The public figures do not support that conclusion. Replacement would depend on much more than the number of buildings. A substitute fab must have compatible process technology, qualified equipment, trained staff, approved designs, materials, utilities, packaging and testing links, and available capacity at the moment demand is disrupted.
TSMC has not published a site-by-site share of leading-edge output in the cited sources, nor a crisis-replacement rate. The Arizona, Japan and Germany projects are also at different stages: one Arizona fab and the first Kumamoto fab are in volume production, while other facilities are being equipped or built. Even an operating plant may serve different process generations or end markets from a Taiwan fab.
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For that reason, do not turn the “more than 17 million” global capacity number into Taiwan capacity, and do not infer overseas capacity proportions from facility counts. The company’s disclosures establish presence, schedules and selected process goals, but not how many Taiwan wafers could be rerouted within weeks or months.
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TSMC’s Form 20-F describes exposure to political, economic, financial, military and other developments in the jurisdictions where it operates, particularly the Republic of China (Taiwan). It notes that most principal executive officers and principal production facilities are located in Taiwan. The filing identifies these conditions as risk factors; it does not assign a probability to an invasion, blockade or other form of conflict.
Physical and operational disruption
A severe crisis could affect fabs, power, water, transport, employee access, ports, suppliers and customer logistics. The filing does not quantify the likelihood or duration of such an event, so a precise revenue or production-loss estimate cannot be derived from it. The practical exposure is that a large, technologically important manufacturing base remains concentrated in one jurisdiction even as the company adds capacity elsewhere.
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Trade and regulatory disruption
The risk is not limited to military action. TSMC warns that trade tensions can produce barriers, sanctions and import or export controls. Those measures could raise manufacturing costs, restrict supplies or production equipment, reduce competitiveness or limit the markets in which products can be sold. A company could therefore face material disruption without a physical attack on a fab.
Supply and equipment access
Advanced semiconductor manufacturing relies on specialized equipment, materials and international logistics. TSMC’s filing identifies constrained access to supplies and equipment as a possible channel for higher costs or reduced production. The disclosure does not provide a single “critical item” whose loss would determine the outcome; the risk is a combination of dependencies across jurisdictions.
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TSMC says its customer end markets are diverse. Its reported 534 customers and 12,682 products illustrate a broad commercial base, but customer diversity answers a different question from geographic resilience. Many customers can still depend on the same Taiwan production network, specialized process family or packaging flow.
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Likewise, having fabs in several countries does not prove that every customer design can be moved between them. Semiconductor designs are qualified for particular process technologies, and moving production requires engineering work, capacity and customer approval. The cited disclosures do not state how many products are portable across sites or how quickly such transfers could occur.
How investors should interpret TSMC’s Taiwan exposure
For a personal-finance reader, the useful distinction is between operational exposure and portfolio exposure. Operational exposure concerns where TSMC makes chips and the events that could interrupt that activity. Portfolio exposure concerns how much of your own savings depends on TSMC, semiconductor companies, technology funds or markets that could react to the same event.
Use a fact-based checklist
- Separate global capacity from Taiwan capacity. The 2025 total of more than 17 million 12-inch-equivalent wafers is global and should not be presented as Taiwan output.
- Track status, not announcements alone. Distinguish volume production, equipment installation, construction and early-stage plans. Arizona’s second facility, for example, has a company target of high-volume manufacturing in the second half of 2027, while its third facility only began construction in 2025.
- Check process compatibility. A facility serving automotive or industrial specialty technologies is not automatically a substitute for a leading-edge smartphone or accelerator process.
- Look for disclosed output data. If a future filing provides site-level wafers, utilization or product transfers, those figures would be more informative than a fab count. Until then, avoid precise substitution claims.
- Stress-test concentration in your own finances. Review whether a single stock, semiconductor exchange-traded fund, employer equity plan or technology-heavy allocation creates overlapping exposure. Diversification can reduce concentration risk but cannot eliminate market-wide losses.
What not to infer from headlines
- Do not treat a new overseas fab as proof that Taiwan capacity is replaceable today.
- Do not treat a construction start as completed production.
- Do not convert commonly repeated global chip-share slogans into a Taiwan percentage unless the source supplies the precise year, metric and denominator.
- Do not read a risk-factor warning as a prediction. TSMC’s Form 20-F lists possible channels and consequences but does not estimate conflict probability.
How to follow the situation over time
Use primary company disclosures rather than relying on a single project headline. TSMC’s annual-report website provides management commentary, facility updates, capacity information and reported shipment figures. Its SEC Form 20-F contains the formal risk-factor language and is useful for tracking changes to political, trade and supply-access disclosures.
When a new update appears, record four details: the facility and jurisdiction, whether it is operating or still being built, the process or end-market focus, and whether the company gives an actual output or utilization figure. This method prevents a planned fab from being counted as current capacity and prevents a process-specific project from being treated as universal redundancy.
Bottom line
TSMC is diversifying its manufacturing footprint, not abandoning Taiwan. Its first Arizona and Kumamoto fabs have reached volume production, while additional U.S., Japanese and German projects are at different construction or ramp stages. At the same time, TSMC continues major 2-nanometer and advanced-packaging investment in Taiwan, where its largest established manufacturing base remains concentrated.
The company’s own risk disclosures make Taiwan-related political, military, trade and supply disruptions material issues, but they do not predict a conflict or quantify the production that overseas fabs could replace. The most defensible conclusion is therefore limited but important: overseas expansion improves geographic flexibility, while Taiwan remains a significant and not demonstrably replaceable part of TSMC’s manufacturing system.
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