Rao R. Tummala is helping India develop the research, advanced-packaging and industry-collaboration layer behind its semiconductor ambitions. He is not running India’s chip mission or proving that the country has already achieved leading-edge chip production. His role is more specific—and potentially just as important: connecting chip design, packaging, systems engineering, universities, government laboratories and private companies.
Tummala’s influence comes from decades of work in electronic packaging at IBM and Georgia Tech. His current Indian roles include membership of the India Semiconductor Mission’s advisory committee and leadership of the Indian Design, Semiconductor, Packaging and Systems Industry Consortium, or IDSPS.
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Who is Rao Tummala?
Rao R. Tummala is an India-born semiconductor-packaging specialist, IBM Fellow, IEEE Fellow and Georgia Tech professor emeritus. He earned his doctorate at the University of Illinois before building a career in the United States, including senior work at IBM and leadership of the company’s Advanced Packaging Lab.
At Georgia Tech, Tummala founded the Packaging Research Center, an industry–academic research model focused on connecting university research with practical electronics manufacturing. His biography also links him to work on low-temperature co-fired ceramic packaging, multi-chip modules, plasma-display technology and system-on-package architectures.
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Professional and institutional profiles have described him with honors such as “father of modern packaging” and “father of system-on-package.” Those are promotional or honorary descriptions, not formal job titles. The more precise description is that Tummala was a leading contributor to major advances in electronic packaging and systems integration.
His relationship with India is longstanding. In interviews and public appearances, he has described his involvement as a way of giving back while helping build capabilities that India has historically lacked: semiconductor manufacturing knowledge, packaging infrastructure, applied research and experienced process talent.
His technical background is summarized in an IEEE technical biography, while an earlier interview traces his path from India to IBM and Georgia Tech.
What did Tummala pioneer?
Electronic packaging is more than a chip casing
A semiconductor package is the physical and electrical bridge between a silicon die and the rest of an electronic system. It provides connections, protects the device, helps remove heat and allows the chip to be assembled into a circuit board or larger product.
In advanced systems, however, packaging is not merely a finishing step. The package can determine how quickly data moves between components, how much power the system consumes, how efficiently it sheds heat and whether different types of dies can work together.
Low-temperature co-fired ceramics
Low-temperature co-fired ceramic, or LTCC, technology uses layered ceramic materials and conductive paths that can be fired together into compact multilayer structures. The result can be useful for miniaturized, high-frequency and harsh-environment electronics.
India is not starting from zero in this area. During a November 12, 2025 visit to the Indian Space Research Organisation’s Space Applications Centre, Tummala reviewed Indian work involving semiconductor fabrication and packaging. ISRO said the discussion included in-house LTCC foundry technology and its use in electronics-system miniaturization.
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Multi-chip modules and system-on-package
A system-on-chip places many functions on one piece of silicon. A system-on-package instead integrates multiple dies or components inside a package. That approach can shorten interconnects, increase bandwidth and combine technologies that would be difficult or uneconomic to manufacture on a single die.
System-on-package designs can include heterogeneous components such as processors, memory, sensors, radio-frequency devices and power-management circuits. They are especially relevant as improving system performance becomes less dependent on simply shrinking every transistor.
Packaging does not replace wafer fabrication or solve every semiconductor problem. It introduces its own challenges, including thermal management, assembly yield, known-good-die availability, package warpage, reliability, testing and coordination among design and manufacturing teams.
Why packaging matters to India’s semiconductor strategy
India’s chip ambitions require more than a wafer fabrication plant. A functioning semiconductor ecosystem also needs:
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- Semiconductor materials and manufacturing equipment.
- Assembly, testing, marking and packaging facilities.
- Advanced packaging and heterogeneous-integration expertise.
- Reliability, qualification and testing laboratories.
- University research and technology-transfer mechanisms.
- Process engineers, technicians and manufacturing managers.
- Customers prepared to design products around available domestic capabilities.
India has substantial engineering, software and chip-design talent. Its weaker areas have traditionally included large-scale manufacturing infrastructure, process experience and the supplier networks required to operate semiconductor facilities consistently.
That is where Tummala’s emphasis matters. He approaches the industry at the level of the complete electronic system: the chip, the package, the board, the application and the manufacturing process. This complements India’s design strengths while addressing the practical gap between an idea on a circuit diagram and a qualified product shipped at scale.
What exactly is Tummala’s role in India?
India Semiconductor Mission adviser
Tummala is listed on the India Semiconductor Mission advisory committee. The committee brings together government, industry and academic figures. Membership indicates advisory participation; it does not mean that Tummala runs ISM, controls every approved project or directly manages a fabrication plant.
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Government material has highlighted his background in advanced packaging and his experience at IBM and Georgia Tech. His relevance to ISM is primarily research, packaging, systems integration, skills and industry–academia collaboration.
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R&D strategist
In a 2024 IEEE Spectrum interview, Tummala said India had identified 12 strategic research areas. He described a proposed structure built around a primary center of excellence—typically at an IIT—with satellite centers elsewhere in the country.
That account describes an R&D architecture, not proof that 12 fully operational centers had already been established. A research plan must still be judged by evidence such as funded laboratories, functioning equipment, industrial projects, trained personnel, qualified processes and commercial outcomes.
IDSPS leader
A March 18, 2026 Press Information Bureau release identified Tummala as CEO of IDSPS, the Indian Design, Semiconductor, Packaging and Systems Industry Consortium. It said he presented the consortium’s vision, strategy, programs and future plans at an Industry Advisory Board meeting.
IDSPS should not be treated as another name for the entire India Semiconductor Mission. It is an industry–academic collaboration vehicle with a particular focus on design, semiconductors, packaging and systems.
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The ISRO visit illustrates a practical dimension of Tummala’s work. He reviewed the Space Applications Centre’s semiconductor and packaging capabilities and discussed possible collaboration under the IDSPS program. The visit is evidence of institutional engagement, not evidence that every proposed collaboration has become a funded production program.
What the 2024 IEEE Spectrum interview established
The interview provided Tummala’s explanation of India’s opportunity and limitations. He said the country had announced a major semiconductor investment effort and wanted to build both manufacturing and research capacity.
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He identified India’s engineering talent, software base and chip-design capability as advantages, while acknowledging that the country lagged in manufacturing knowledge and infrastructure. He also drew a line between government and business responsibilities: government can provide policy and funding, but companies must build and operate the industry.
Tummala expressed the view that India could eventually develop leading-edge fabs and a comprehensive system-level electronics ecosystem. Those are his forecasts, not independently verified outcomes. Current activity through ISM, ISRO and IDSPS shows continued institutional effort, but it does not establish that India has already reached leading-edge manufacturing parity with Taiwan, South Korea or the United States.
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Can advanced packaging help India leapfrog?
Yes, but only as a strategic entry point—not as a substitute for the entire semiconductor supply chain.
Advanced packaging can create value even when a country is still developing front-end wafer-fabrication capacity. It can support chiplets, heterogeneous integration, specialized systems, sensors, communications hardware and space electronics. It may also let designers combine locally developed components with externally manufactured dies.
But packaging leadership requires its own capabilities. India would need specialized substrates, materials, assembly equipment, thermal solutions, inspection and metrology, design tools, test systems, reliability expertise and customers willing to qualify the results.
The central trade-off is between research ambition and manufacturing discipline. A university center can produce valuable research and train engineers, but a production facility must also demonstrate repeatability, yield, contamination control, reliability, customer qualification and cost competitiveness.
Packaging-first development can therefore complement the pursuit of wafer fabs. It cannot eliminate the need for fabrication, materials, equipment, testing or a deep supplier base.
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The trade-offs in Tummala’s proposed R&D model
Central coordination versus distributed capability
A small number of centers of excellence can concentrate expensive equipment and scarce expertise. Satellite centers can spread access and talent development across India. The risk is that satellite institutions may not have the same equipment, process discipline or experienced staff as the main centers.
Government funding versus private execution
Public funding can establish laboratories, support long-horizon research and reduce early risk. It cannot by itself create commercial demand or guarantee manufacturing yield. Private companies must translate research into products, facilities, hiring and customer-qualified processes.
System-on-package versus system-on-chip
System-on-package can improve integration and performance, but it is not universally superior. It may increase test complexity, introduce thermal and reliability problems and require a reliable supply of known-good dies. The right choice depends on the application, cost target, performance requirements and available manufacturing ecosystem.
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Tummala’s formal positions and technical credentials establish credibility. They do not, by themselves, prove that India’s semiconductor strategy is succeeding. A useful scorecard would look for:
- Operating research centers: laboratories with equipment, staff, budgets and published technical output.
- Industry-funded projects: research tied to real product or process requirements rather than only academic milestones.
- Pilot lines and qualified processes: demonstrations that can be repeated with measurable yield and reliability.
- Packaging design and test infrastructure: tools and services that companies can actually use.
- Workforce development: trained technicians, process engineers, packaging designers and manufacturing managers.
- Technology transfer: patents, licenses, startups, joint ventures and products that leave the laboratory.
- Commercial production: components and systems shipped to paying customers at sustainable quality and cost.
This distinction matters because announcements, advisory appointments and research proposals are early indicators. They are not equivalent to operating capacity.
The bottom line on Rao Tummala
Rao Tummala is best understood as a packaging and systems-integration expert helping India build the layer between chip design and a complete semiconductor manufacturing ecosystem. His ISM advisory role, IDSPS leadership and engagement with ISRO show continued participation in India’s semiconductor push through 2026.
His contribution is not proof that India already has leading-edge chip production, nor is he the sole architect of the country’s strategy. The more defensible conclusion is narrower and more useful: Tummala is helping India organize research, packaging expertise and industry collaboration around capabilities that any serious semiconductor ecosystem needs.
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